Thermal resistance analysis and validation of flip chip PBGA packages

Chen, Kuo-Ming; Houng, Kuo-Hsiung; Chiang, Kuo‐Ning

doi:10.1016/j.microrel.2005.06.001

Cited by 15 publications

(5 citation statements)

References 6 publications

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“…Chen el al. [4] proposed a finite element methodology to predict the thermal resistance of both FC-PBGA with a bare die and FC-PBGA with a metal cap. They reported that the material of the metal cap slightly influenced the thermal resistance when the heat dissipation was saturated through the metal cap.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly

Lin¹,

Wu²,

Ju³

2013

JECTC

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In this paper, three-dimensional finite element analysis using the commercial ANSYS software is performed to study the thermal performance of a thermally enhanced FC-PBGA (flip-chip plastic ball grid array) assembly in both natural and forced convection environments. The thermally enhanced FC-PBGA assembly is a basic FC-PBGA assembly with a lid attached on top, after which an extruded-fin heatsink is attached on the top of the lid. The finite element model is complete enough to include key elements such as bumps, solder balls, substrate, printed circuit board, extruded-fin heatsink, lid, vias, TIM1 (thermal interface material 1), TIM2 (thermal interface material 2), lid-substrate adhesive and ground planes for both signal and power. Temperature fields are simulated and presented for several package configurations. Thermal resistance is calculated to characterize and compare the thermal performance by considering alternative design parameters of the polymer-based materials and the thermal enhancement components. The polymer-based materials include underfill, TIM1, TIM2, lid-substrate adhesive and substrate core material. The specific thermal enhancement components are the extruded-fin heatsink and the lid.

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Section: Introductionmentioning

confidence: 99%

Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly

Lin¹,

Wu²,

Ju³

2013

JECTC

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“…Previous research [10,11] has shown the thermal performance of packaging would affect reliability and functionality of device. In the present study, the thermal performance of the proposed packaging structure is analyzed.…”

Section: Introductionmentioning

confidence: 99%

“…The route of heat dissipation is observed through FE analysis. The simulation methodology is taken from our previous work [10] and validated with the thermal resistance experiment. In addition, the effects of the main design parameters of the proposed packaging structure are observed.…”

Section: Introductionmentioning

confidence: 99%

Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging

Lin

Kuo

et al. 2013

2013 IEEE 63rd Electronic Components and Technology Conference

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In recent years, consumer electronics demand has been geared towards lightweight, high capacity, and high efficiency small form factor devices. These characteristics can be achieved by using three-dimensional (3D) integrated circuit (IC) technology. This study proposes a double-chip stacking structure in an embedded fan-out wafer level packaging (WLP) with double-sided interconnections. This structure consists of two or more thin dies, chip carriers, through mold vias (TMV), and interconnection structures. The thermal performance of the proposed packaging structure is examined and discussed by using finite element (FE) analysis. An FE model of the WLP is also established to compare the thermal performance of conventional WLP and the proposed packaging structure. The proposed packaging structure has a larger size and silicon carrier, which reduces its thermal resistance from 49 °C/W to 39 °C/W. By adopting the proposed design guidelines, including carrier material selection, and designating thermal vias and chip/package size ratios, FE analysis determined that the thermal performance of the proposed packaging structure can be further improved, thereby enhancing its suitability for applications with high power density.

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“…Chen et al [6] proposed an effective methodology that integrates an IR thermometer measurement and a numerical modeling technique to predict the thermal characterization of packages. Chen et al [7] also employed the FEM numerical methodology. The thermal resistance experiment was performed to verify the FEM results.…”

Section: Introductionmentioning

confidence: 99%

Transient thermal analysis of high-concentration photovoltaic cell module subjected to coupled thermal and power cycling test conditions

Wang

Chiang

Chou

et al. 2010

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

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Based on the standard of International Electrotechnical Commission (IEC) on the thermal cycling test for a high concentration photovoltaic (HCPV) module, frequent current input must be applied when oven temperature exceeds 25 o C. As such, the junction temperature of a solar cell chip would oscillate due to the joule heating effect. However, the fluctuation of the junction temperature might be one of the reliability issues being faced by an HCPV thermal cycling test. The process of getting the actual junction temperature is necessary before its mechanical behavior is discussed. In this study, the forward voltage method was adopted to measure and monitor the time-dependent junction temperature of an HCPV module. In addition, a detailed finite element (FE) model of the HCPV module with adapted input power and suitable boundary condition was established, analyzed, and validated with the experimental data. Results on the finite element analysis (FEA) were consistent with the experimental data. Hence, we conclude that the simulation of the FE model adopted in this research can be effectively used to simulate the transient thermal characteristics of an HCPV module, subjected to coupled power and thermal cycling test conditions. KEY WORDS: HCPV module, solar cell, finite element, transient thermal analysis, thermal cycling test, power cycling test. INTRODUCTIONThe demand for energy resources that improve our quality of life continues to intensify. Moreover, prices of fossil fuel keep on rising and its availability remains drastically limited. Consequently, technologies to develop more reusable energy resources, the most common of which is solar energy, have been developed. The solar energy technology is composed of solar cells through which semiconductors transform light into electric power. The difference between the structure of a high concentration photovoltaic (HCPV) system and the traditional solar cell is the former's use of a concentrated-light module to enhance optic-electric transition efficiency. Moreover, an HCPV system uses highly efficient multi-junction solar cells,

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Thermal resistance analysis and validation of flip chip PBGA packages

Cited by 15 publications

References 6 publications

Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly

Investigation of Thermal Characterization of a Thermally Enhanced FC-PBGA Assembly

Development of double-sided with double-chip stacking structure using panel level embedded wafer level packaging

Transient thermal analysis of high-concentration photovoltaic cell module subjected to coupled thermal and power cycling test conditions

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