Thermal resistance of cycloaliphatic epoxy hybrimer based on sol‐gel derived oligosiloxane for LED encapsulation

Yang, SeungCheol; Kim, Joon-Soo; Jin, Jung Ho; Kwak, Seung‐Yeon; Bae, Byeong‐Soo

doi:10.1002/app.31702

Cited by 31 publications

(34 citation statements)

References 14 publications

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“…However, the 5% weight loss temperature of cycloaliphatic epoxy hybrimer synthesized by Yang et al . is 350°C . The high thermal stability of the prepared encapsulation material is similar to that of other siloxane‐based LED encapsulants and is appropriate for the demands required by an LED encapsulant …”

Section: Resultsmentioning

confidence: 75%

Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant

Zhao

Feng

et al. 2014

Polymers for Advanced Techs

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Addition-cure silicone resin is considered as a good choice for light emitting diodes (LEDs); however, it has very poor adhesion to the substrate, which limits its practical application. A novel polysiloxane with self-adhesion ability and higher refractive index for the encapsulating of high-power LEDs is prepared and characterized. This polysiloxane containing vinyl groups, phenyl groups, and epoxy groups was synthesized by a sol-gel condensation process from methacryloxy propyl trimethoxyl silane, γ-(2,3-epoxypropoxy)propytrimethoxysilane, and diphenylsilanediol under the catalysis of an anion exchange resin. Then, the resin-type encapsulation material was prepared by hydrosilylation of methylphenyl hydrogen-containing silicone resin and the newly synthesized polysiloxane material. The novel polysiloxane was characterized by 1 H-NMR and Fourier transform infrared spectroscopy. On the basis of higher refractive index, higher transparency, excellent thermal stability, and appropriate hardness, as well as good adhesive strength between the encapsulating material and the LED lead frame (polyphthalamide), the curable silicone resin-type encapsulation material can be used as an encapsulant for LEDs.

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Section: Resultsmentioning

confidence: 75%

Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant

Zhao

Feng

et al. 2014

Polymers for Advanced Techs

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“…The thermal stability is an important parameter to determine encapsulating materials' lifetime and applications . Thermal gravimetric analysis was used to analyze the thermal degradation process as shown in Fig.…”

Section: Resultsmentioning

confidence: 99%

Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation

Liu

Luan

Feng

et al. 2017

Polymers for Advanced Techs

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In this paper, we prepared the light emitting diode (LED) encapsulant with self‐adhesion and high refractive index. In order to improve adhesion properties, we synthesized a series of multifunctional polysiloxanes with different contents of epoxy groups via the sol–gel condensation of methylvinyldimethoxysilane, diphenylsilanediol and 3‐glycidoxypropyldimethoxymethylsilane. The structures of epoxyphenylvinyl silicone (EPVS) resins were confirmed by proton nuclear magnetic resonance and Fourier‐transform infrared. The effect of epoxy group content on the adhesion property of EPVS resins was fully studied. The performances of the LED encapsulation materials based on EPVS resins were investigated in detail. These self‐adhesive encapsulating materials showed excellent thermal stability, a high refractive index of 1.55 and good adhesive property. These EPVSs can be used as an adhesion promoter for LED encapsulation materials. Copyright © 2017 John Wiley & Sons, Ltd.

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“…This high-thermal stability (>300 C) of Ormosil-modified epoxy resins is analogous to that of other siloxane based LED encapsulants and is appropriate for the demands required by application as an LED encapsulant. 3 Moreover, the high-thermal stability decreases yellowing under the influence of heat. In addition, the incorporation of Ormosil into epoxy resulted in improvement their processability and thermal stability, with a retarded mass loss rate and an enhanced char yield.…”

Section: Thermal Stabilitymentioning

confidence: 99%

“…It can be further increased by increasing the refractive index of encapsulant and modifying the structural design to inhibit total reflection and refraction of light. [1][2][3] Transparent epoxy resins are generally used as encapsulants in the blue LED assembly field. 4 However, there are two major disadvantages of using epoxy resins as LED encapsulants.…”

Section: Introductionmentioning

confidence: 99%

Study of thermal and optical properties of epoxy/organically modified silicate hybrids

Wu¹,

Cheng²,

Wang³

et al. 2016

Mat Express

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Three epoxy resins were examined in this study: Eporite-901 (474 g/eq), Eporite-904 (807 g/eq) and Eporite-909 (1915 g/eq), which are bisphenol-A-type epoxy resins. In this study, we used an amine terminated organically modified silicate (Ormosil) that was compatible with the diglycidyl ether of bisphenol-A epoxy to partially replace the epoxy resin at various ratios, cured by hexahydrophthalic anhydride (HHPA). The thermal and optical properties of the Ormosil-modified epoxy resins (Epoxy/Ormosil) were studied. The M n and M w of the resulting hybrids were in the range of 10668-31450 and 30617-120422, respectively, with a polydispersity index range of 2.870-3.829. The thermogravimetric analysis (TGA) results implied that Ormosil can raise the crosslink density and enhance the thermal properties. The optical properties were measured after curing and thermal aging of the polymer films with thickness around 8-10 mm. The refractive indexes of the Epoxy/Ormosil hybrids were 1.62-1.68, and the transmittances of the cured composites were above 85% in the visible wavelength.The key attributes of Epoxy/Ormosil hybrids that make them attractive materials for LEDs including their high transparency in the UV-visible region, controlled refractive index (RI), and excellent thermal resistance.

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Thermal resistance of cycloaliphatic epoxy hybrimer based on sol‐gel derived oligosiloxane for LED encapsulation

Cited by 31 publications

References 14 publications

Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant

Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant

Self‐adhesive epoxy modified silicone materials for light emitting diode encapsulation

Study of thermal and optical properties of epoxy/organically modified silicate hybrids

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