Cycloaliphatic epoxy hybrimer bulk was successfully fabricated by thermal curing of cycloaliphatic epoxy oligosiloxane resin synthesized by a sol-gel condensation reaction with methylhexahydrophthalic anhydride (MHHPA) and tetrabutylphosphonium methanesulfonate (TBPM). The composition of MHHPA and TBPM in the resin was optimized to minimize yellowness of the cycloaliphatic epoxy hybrimer bulk. The sample with the optimized composition showed little discoloration upon thermal aging at 120 C for 360 h under an air atmosphere. On the basis of its high thermal stability with appropriate hardness and a high refractive index of 1.55, cycloaliphatic epoxy hybrimer bulk can be used as a LED encapsulant for white LEDs.

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Cyclo-aliphatic epoxy and methacrylate hybrimers were fabricated via the photocationic polymerization of cycloaliphatic epoxy oligosiloxanes and photoradical polymerization of methacrylate oligosiloxanes, respectively. The thermomechanical/thermal properties of these two hybrimers using different photo-polymerization mechanisms were compared. Although both oligosiloxanes showed similar degrees of condensation, siloxane network structures, and sizes, the cycloaliphatic epoxy hybrimer showed improved thermomechanical/thermal properties as compared to the methacrylate hybrimer. This was attributable to a highly crosslinked network structure developing from the living characteristics of photocationic polymerization and the short, compact organic chains of the cycloaliphatic epoxy hybrimer as compared to the methacrylate hybrimer.

Nano‐sized epoxy oligosiloxanes (EO) were prepared by condensation reaction between 3‐glycidoxypropyltrimethoxysilane (GPTS) and Diphenylsilandiol (DPSD). Through a composition change of GPTS and DPSD, EO of various structure and sizes were obtained. The molecular structure and size of EO synthesized were investigated by experimental measurements. Regardless of their composition, molecular structure of EO was linear or branch. The amount of species of high molecular weight and their molecular size increased with addition of DPSD. We confirmed that epoxy groups of EO were thermally cured using a thermal initiator and curing agent. Finally, we fabricated transparent epoxy‐based hybrimer films by thermal curing of EO resins. © 2009 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 47: 756–763, 2009

Mushroom-shaped phase change memory (PCM) consisting of a Cr/In(3)Sb(1)Te(2) (IST)/TiN (bottom electrode) nanoarray was fabricated via block copolymer lithography and single-step dry etching with a gas mixture of Ar/Cl(2). The process was performed on a high performance transparent glass-fabric reinforced composite film (GFR Hybrimer) suitable for use as a novel substrate for flexible devices. The use of GFR Hybrimer with low thermal expansion and flat surfaces enabled successful nanoscale patterning of functional phase change materials on flexible substrates. Block copolymer lithography employing asymmetrical block copolymer blends with hexagonal cylindrical self-assembled morphologies resulted in the creation of hexagonal nanoscale PCM cell arrays with an areal density of approximately 176 Gb/in(2).