Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs

Abstract

This work presents an algorithm for simulating more accurate temperature distribution in two-phase liquid cooling for three-dimensional integrated circuits than the state of-the-art methods by utilizing local multi-linear interpolation techniques on heat transfer coefficients between the microchannel and silicon substrate, and considering the interdependence between the thermal conductivity of silicon and temperature values. The experimental results show that the maximum and average errors are only 9.7% and 6.7% compared with the measurements, respectively.

The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach

“…The two-phase 3D liquid cooling systems has been studied in [29,107]. However, such mechanical cooling solutions are expensive and not suitable for the mobile devices.…”

“…The thermal problem has become the bottleneck in the design of future generations of high-performance computing systems [116,112,33,32,116,149,23,123,29,107,128,135].…”

“…To mitigate the thermal crisis, some mechanical solutions have been explored, such as building heat sinks, heat spreaders, cooling fans or other advanced cooling mechanisms (e.g. embedded micro-channel liquid cooling on 3D processors [141] or using phase change coolant [29]). However, designing such a heat dissipation package is uneconomical if not infeasible [131], and it is unsuitable for hand-held devices [119].…”