Thermal stress analysis of direct chip attach electronic packaging assembly

Pang, H.L.J.; Tan, Tze-Ing; Lim, G.Y.; Wong, C. L.

doi:10.1109/eptc.1997.723905

Cited by 11 publications

(4 citation statements)

References 2 publications

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“…The exponent takes into account the mean temperature ( ) and cyclic frequency ( ) of the temperature cycling loading. Solomon [17] provided solder joint low-cycle fatigue (LCF) relationship (2) This model was developed from an isothermal low cycle fatigue test data based on plastic strain control tests. The equation given here is for the case when only the plastic shear strain range is dominant at C. Knecht and Fox [18] developed a model based on the matrix creep strain range per cycle (3) This model assumes that the creep shear strain is dominant in the solder joints and the fatigue life during thermal cycling is due to cyclic creep strain accumulated.Combining the fatigue and creep models in (2) and (3) based on a Miner's superposition principle provide a combined Creep-Fatigue life prediction model [19].…”

Section: Fatigue Life Prediction Modelsmentioning

confidence: 99%

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

Pang

Chong²

2001

IEEE Trans. Adv. Packag.

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This study investigates the effects of employing different two-dimensional (2-D) and three-dimensional (3-D) finite element analysis (FEA) models for analyzing the solder joint reliability performance of a flip chip on board assembly. The FEA models investigated were the 2-D-plane strain, 2-D-plane stress, 3-D-1/8th symmetry and 3-D-strip models. The different stress and strain responses generated by the four different FEA models were applied to various solder joint low cycle fatigue life prediction relationships. The investigation shows that the 2-D-plane strain and 2-D-plane stress models gave the highest and lowest solder joint strains, respectively. The 3-D-strip and 3-D-1/8th symmetry model results fall in between the 2-D-plane strain and 2-D-plane stress model results. The 3-D-1/8th symmetry model agrees better with the 2-D-plane strain model, while the 3-D-strip model agrees better with the 2-D-plane stress model results. The results for the fatigue life prediction analyses also show similar trends.

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Section: Fatigue Life Prediction Modelsmentioning

confidence: 99%

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

Pang

Chong²

2001

IEEE Trans. Adv. Packag.

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“…The mechanical properties of solder alloys were also investigated [ 7 – 9 ]. The effects of thermal and solder joints were examined by Pang et al [ 10 , 11 ] and Michealidas and Sitaraman [ 12 ] in flip chip assemblies. Studies based on experimentation are widely conducted; however, investigations based on numerical simulations are rarely reported.…”

Section: Introductionmentioning

confidence: 99%

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

Aziz

Abdullah

Khor

2014

The Scientific World Journal

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An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises stress of a pin passed through a solder material. A single pin through-hole connector mounted on a printed circuit board (PCB) was simulated using a 3D model solved by FLUENT. The ABAQUS solver was employed to analyze the pin structure at solder temperatures of 456.15 K (183°C) < T < 643.15 K (370°C). Both solvers were coupled by the real time coupling software and mesh-based parallel code coupling interface during analysis. In addition, an experiment was conducted to measure the temperature difference (ΔT) between the top and the bottom of the pin. Analysis results showed that an increase in temperature increased the structural displacement and the von Mises stress. Filling time exhibited a quadratic relationship to the increment of temperature. The deformation of pin showed a linear correlation to the temperature. The ΔT obtained from the simulation and the experimental method were validated. This study elucidates and clearly illustrates wave soldering for engineers in the PCB assembly industry.

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“…He reported that a reasonable increase in the solder height-to-diameter ratio can result in an appreciable reduction in the stress-strain level. Pang et al [2] used two-dimensional (2D) and threedimensional (3D) finite element (FE) models of the flip-chip assembly to investigate curing-induced bending stress development in the silicon chip for a selected set of design parameters. They reported that 2D plane strain FE simulation provides adequate result as compared to the complicated 3D simulation.…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

Tsein

2005

Journal of Reinforced Plastics and Composites

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Flip-chip packaging provides a high-performance low-cost approach for the development of electronic packages. A three-dimensional viscoelastic-plastic finite element analysis using the commercial software ANSYS has been performed to study the thermomechanical behavior in flip-chip assemblies, i.e., the four components, chip, solder ball, underfill, and substrate. The viscoelastic behavior of the underfill is modeled on the Maxwell constitutive equation while the viscoplastic behavior of the solder balls is modeled by the Anand model. Both the chip and the substrate are assumed to be elastic materials modeled by the Hooke's law. As in standard industry practice, temperature cycling from 125 to 55°C is used. Simulated thermomechanical behavior is presented for the solder balls. Subsequently, the effects of underfill-material properties, such as elasticity and coefficient of thermal expansion are also investigated.

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Thermal stress analysis of direct chip attach electronic packaging assembly

Cited by 11 publications

References 2 publications

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

Flip chip on board solder joint reliability analysis using 2-D and 3-D FEA models

Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

Three-dimensional Finite Element Analysis of Thermomechanical Behavior in Flip-chip Packages under Temperature Cycling Conditions

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