Thermal stresses in multilayer ceramic capacitors: numerical simulations

Scott, G. C.; Astfalk, Greg

doi:10.1109/33.62564

Cited by 10 publications

(13 citation statements)

References 7 publications

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“…An alternative approach for investigating the internal stress is numerical analysis using the finite element method (FEM). This method has been widely used to analyze stress state in many nano and microstructures including MLCCs [9,10]. Thus, FEM has been adopted herein to obtain the residual stresses as a function of margin width.…”

Section: Numerical Analysismentioning

confidence: 99%

Effect of margin widths on the residual stress in a multi-layer ceramic capacitor

Park

Shin

Hong

et al. 2006

Microelectronic Engineering

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Section: Numerical Analysismentioning

confidence: 99%

Effect of margin widths on the residual stress in a multi-layer ceramic capacitor

Park

Shin

Hong

et al. 2006

Microelectronic Engineering

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“…Therefore, this paper simulates the flip-chip in normal operating temperature and studies the stress on solder joints under the temperature cycling. The FEM (Finite Element Method) simulation analysis technique was used in the present work, as it avoids the approximations of the closed-form solutions in neglecting the strain energy of certain stresses within the solder joints, so more accurate results are obtained [6].…”

Section: Finite Element Analysis and Theoretical Analysismentioning

confidence: 99%

“…In the process of the use of electronic device, the device trends to withstand multiple large thermal loads [5,6]. Periodic changes in temperature causes the solder joints generate periodic internal stress and strain in the process of the temperature cycling.…”

Section: Introductionmentioning

confidence: 99%

The finite element analysis of solder joints under temperature cycling

Liu

Lou

Fufu

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

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A thermal-mechanical coupled finite element analysis model of solder joints is established, which plays a role in mechanical support and electrical connection in flip chip. Periodic temperature cycle load (-45 ~125 ) applied on the solder joints and it will generate periodic internal stress and strain in the process of the temperature cycling. With repeat using, the solder joints will produce deformation, and then cracks, extension, interlayer delaminating. The failure of the solder joints may cause the failure of the entire switch. This paper aims to simulate the periodic changes in temperature and obtain the reliability and potential failure modes of solder joints under temperature cycling, thus providing theory reference for the design and application of the novel solid MEMS switch.

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“…Thus, FEM has been widely used to analyze the stress state in many nano- 9 and microstructures including MLCCs. [10][11][12][13] It has thus been adopted herein to elucidate the physical origin of the evolution of residual stresses in a MLCC and the numerical result has been compared with some experimental data in the literature. Figure 1 shows the considered geometry of a MLCC as well as a one-eighth space of the three-dimensional ͑3D͒ geometry that was modeled with appropriate boundary conditions to reduce computational load.…”

Section: Physical Origin Of Residual Thermal Stresses In a Multilayermentioning

confidence: 99%

Physical origin of residual thermal stresses in a multilayer ceramic capacitor

Shin

Park

Hong

et al. 2007

Journal of Applied Physics

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Residual stress evolution in multilayer ceramic capacitors corresponding to layer increase and its correlation to the dielectric constant J. Appl. Phys. 97, 094504 (2005) The physical origin of the residual stresses developed in the ceramic layer of the active region in a multilayer ceramic capacitor was numerically investigated. The compressive in-plane stress components 11 and 22 originate without regard to the presence of the margins but rather from the difference in in-plane thermal shrinkage between ceramic and metal electrode. The out-of-plane stress component 33 physically originates mainly through the presence of the housing margin; the presence of the lateral margin is a minor source: the more ceramic-rich margins hinder the apparent vertical shrinkage of the active region to yield tensile 33 .

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Thermal stresses in multilayer ceramic capacitors: numerical simulations

Cited by 10 publications

References 7 publications

Effect of margin widths on the residual stress in a multi-layer ceramic capacitor

Effect of margin widths on the residual stress in a multi-layer ceramic capacitor

The finite element analysis of solder joints under temperature cycling

Physical origin of residual thermal stresses in a multilayer ceramic capacitor

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