Thermal transport in polymeric materials and across composite interfaces

Mehra, Nitin; Mu, Liwen; Ji, Tuo; Yang, Xin; Kong, Jie; Gu, Junwei; Zhu, Jiahua

doi:10.1016/j.apmt.2018.04.004

Cited by 358 publications

(191 citation statements)

References 411 publications

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“…But in ceramics (eg, BN and AlN), heat transfer takes place through phonon transfer. A phonon is defined as the quantized energy of lattice vibration . Phonons packets of sound found present because of vibration in the lattice, but the lattice vibration cannot be sounded.…”

Section: Resultsmentioning

confidence: 99%

“…In 40%Gr + 60%Ep, heat transfer takes place through electron and phonon conduction with no phonon quanta energy diminution and/or scattering at filler/filler (ie, graphite/graphite) interfaces. But in 60%(Gr/h‐BN) + 40%Ep, the total phonon quanta energy is reduced because of intrinsic TC mismatch, collision, and phonon scattering at Gr and BN interfaces . Secondly, h‐BN has low intrinsic TC, lack of electron conduction, and smaller shape and size, which generates low amplitude phonon wave quantum energy than Gr at filler matrix interfaces .…”

Section: Resultsmentioning

confidence: 99%

“…The residual weight of the filler and hybrid filler incorporated epoxy composites was found to be 36%, 45%, 47%, and 49% for the composites containing 40, 60, 60, and 60 wt% of Gr, Gr, Gr/h‐BN, and Gr/Ag, respectively. The high residual mass of the composites might be due to the strong compatibility and interaction of Gr, h‐BN, and Ag with epoxy resin …”

Section: Resultsmentioning

confidence: 99%

“…But in 60%(Gr/h-BN) + 40%Ep, the total phonon quanta energy is reduced because of intrinsic TC mismatch, collision, and phonon scattering at Gr and BN interfaces. 18 Secondly, h-BN has low intrinsic TC, lack of electron conduction, and smaller shape and size, which generates low amplitude phonon wave quantum energy than Gr at filler matrix interfaces. 19,20 On another side, hybrid formulation of Gr with BN also avoids agglomeration of graphite particles and increases the dispersion and interaction of filler inside epoxy matrix (due to organic and inorganic nature of hybrid fillers), which help in the formation of the thermal conductive percolated network inside epoxy matrix.…”

Section: From Equation 2mentioning

confidence: 99%

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Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

Kumar

Mishra

Sahoo

et al. 2019

Polymers for Advanced Techs

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Thermal management is an important parameter in an electronic packaging application. In this work, three different types of fillers such as natural graphite powder (Gr) of 50‐μm particle size, boron nitride powder (h‐BN) of 1‐μm size, and silver flakes (Ag) of 10‐μm particle size were used for thermal conductivity enhancement of neat epoxy resin. The thermal properties, rheology, and lap shear strength of the neat epoxy and its composite were investigated. The analysis showed that the loading of different wt% of Gr‐based fillers can effectively increase the thermal conductivity of the epoxy resin. It has also been observed that the thermal conductivity of the hybrid filler (Gr/h‐BN/Ag) reinforced epoxy adhesive composite increased six times greater than that of neat epoxy resin composite. Further, the viscosity of hybrid filler reinforced epoxy resin was found to be increased as compared with its virgin counterpart. The adhesive composite with optimized filler content was then subsequently subjected to determine single lap shear strength. The degree of filler dispersion and alignment in the matrix were determined by scanning electron microscopy (SEM) analysis.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: From Equation 2mentioning

confidence: 99%

See 2 more Smart Citations

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

Kumar

Mishra

Sahoo

et al. 2019

Polymers for Advanced Techs

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“…In consideration of the theoretically high thermal conductivity of Si 3 N 4w , the thermal conductivity of Si 3 N 4w /epoxy is not high enough as expected. The two main reasons are as follows: first, the filler content of 7 vol%, which is uniformly distributed in the matrix and not in contact with each other, is too low for the Si 3 N 4w to build continuous 3D networks; second, the thermal conductivity of the epoxy composite is always degraded by interfacial thermal resistance originating from the phonon vibration and scattering (such as elastic, inelastic, specular reflection, or diffusion) of the matrix, filler, intermediate phase, and the interface among them . The thermal resistance at the interface among the nanoscale Si 3 N 4w , the specific area of which is almost 10 times larger than that of the Si 3 N 4p , and the epoxy matrix is high, thereby blocking heat transfer in Si 3 N 4w /epoxy.…”

Section: Thermal Conductivity Of the Compositementioning

confidence: 99%

Promotion of the mechanical properties and thermal conductivity of epoxy by low Si₃N₄ whisker content and its mechanisms

Liu

Zhang

Liu³

et al. 2019

J of Applied Polymer Sci

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Si3N4 whisker (Si3N4w) is selected as epoxy filler. The influence of filler content on the bulk density, porosity, bending strength, Young's modulus, critical stress intensity factor, work of failure, morphologies of fracture surface, and thermal conductivity of Si3N4w/epoxy is investigated. The bending strength is 82.63 MPa at a Si3N4w content of 5 vol% and increases to 25.29% more than that of neat epoxy. Compared with that of neat epoxy, the work of failure and thermal conductivity increase by 455% and 34.78% to 18 248.92 J·m−2 and 0.31 W·m−1·K−1, respectively, at a Si3N4w content of 7 vol%. However, Si3N4w/epoxy becomes sensitive to precrack due to a weak CN bond and residual tensile stress at the interface, thereby resulting in the decline of critical stress intensity factor. The coexistence of various energy dissipation mechanisms, namely, steps, craters or depressions, stress whitening, plastic flow, pull out of Si3N4w, and rough fracture surface, is observed in Si3N4w/epoxy. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020, 137, 48721.

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Carbon Black

Niedermeier,

Chavez,

Westenberg

et al. 2024

Encyclopedia of Polymer Science and Technology

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Carbon black is a high‐tech raw material, with clearly defined properties, widely used in different fields of applications, as an excellent black pigment, reinforcing particle in polymers, UV‐protection agent as well as conductive material in batteries. Due to its excellent pigmentation properties, especially its light stability and universal insolubility, carbon black has been used as a black pigment since early times. Today you can find it in car coatings, black dashboards, and inks. Carbon black is also used as reinforcing particle to modify the mechanical and electrical properties of elastomers and plastics. Its largest application is in tires to improve durability, abrasion resistance, and traction. The individual morphology parameters of the carbon black are tailored for each application. These parameters as well as the microstructure are discussed after the introduction in the second section. The following section deals with the methods to characterize the morphology and to carefully control the formation process. The following two sections focus on the formation and various production processes. Section 6 is devoted to the applications of carbon blacks in plastics and elastomers as a pigment as well as a reinforcing particle. The subject of achieving optimal quality dispersion and its importance to end‐use performance is also addressed. Finally, the topics of sustainability and product safety are outlined.

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Thermal transport in polymeric materials and across composite interfaces

Cited by 358 publications

References 411 publications

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

Promotion of the mechanical properties and thermal conductivity of epoxy by low Si₃N₄ whisker content and its mechanisms

Carbon Black

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Thermal transport in polymeric materials and across composite interfaces

Cited by 358 publications

References 411 publications

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

Epoxy‐based composite adhesives: Effect of hybrid fillers on thermal conductivity, rheology, and lap shear strength

Promotion of the mechanical properties and thermal conductivity of epoxy by low Si3N4 whisker content and its mechanisms

Carbon Black

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Product

Resources

About

Promotion of the mechanical properties and thermal conductivity of epoxy by low Si₃N₄ whisker content and its mechanisms