Thermally conductive, self-healing, and elastic Polyimide@Vertically aligned carbon nanotubes composite as smart thermal interface material

Yu, Hang; Feng, Yiyu; Chen, Can; Zhang, Zhixing; Cai, Yiqiao; Qin, Mengmeng; Feng, Wei

doi:10.1016/j.carbon.2021.04.055

Cited by 150 publications

(80 citation statements)

References 27 publications

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“…The development of lightness and high integration for electronics inevitably causes serious heat accumulation (> 5 W cm −2 ) [1] and electromagnetic interference (EMI), which trigger increasing demand for effective heat dissipation and EMI shielding at the multifunctional materials level [2][3][4]. In this context, polymer-based composite films integrating excellent thermal conduction and EMI shielding are expected to meet the requirement of electronics manufacturing due to their advantages of lightweight, easy processing and good designability [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

et al. 2021

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The development of lightweight and integration for electronics requires flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding to overcome heat accumulation and electromagnetic radiation pollution. Herein, the hierarchical design and assembly strategy was adopted to fabricate hierarchically multifunctional polyimide composite films, with graphene oxide/expanded graphite (GO/EG) as the top thermally conductive and EMI shielding layer, Fe3O4/polyimide (Fe3O4/PI) as the middle EMI shielding enhancement layer and electrospun PI fibers as the substrate layer for mechanical improvement. PI composite films with 61.0 wt% of GO/EG and 23.8 wt% of Fe3O4/PI exhibits high in-plane thermal conductivity coefficient (95.40 W (m K)−1), excellent EMI shielding effectiveness (34.0 dB), good tensile strength (93.6 MPa) and fast electric-heating response (5 s). The test in the central processing unit verifies PI composite films present broad application prospects in electronics fields.

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Section: Introductionmentioning

confidence: 99%

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

et al. 2021

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“…The BN/SG strips composed of vertically aligned BN in the center and thin horizontally aligned layers on the top and bottom surfaces, featuring the continuous and scalable production, are promising for thermal management of electronic devices [28,[52][53][54]. Figure 6a shows the through-plane thermal conductivity (TC) of both V-BN and R-BN composites gradually increases with increasing BN contents while values for expansion-flow-assisted extrusion with the 0.2-2 mold are always larger than that for random mixing.…”

Section: Thermo-conductive Characterization Of the Bn/sg Stripsmentioning

confidence: 99%

“…Hexagonal boron nitride (h-BN), also named white graphene, shows excellent mechanical strength, high in-plane thermal conductivity (monolayer BN ~ 751 W m −1 K −1 ), good electric insulation (bandgap 5.20-5.97 eV) properties, which exhibits potential applications for thermally conductive and insulating materials [27]. The simple incorporation of h-BN into polymer usually leads to a relatively low through-plane thermal conductivity (TC) due to the large interface thermal resistance (ITR) and anisotropic TC of h-BN [28][29][30]. Constructing continuous thermal pathways is an efficient strategy to decrease ITR and enhance the through-plane TC [31][32][33].…”

Section: Introductionmentioning

confidence: 99%

Vertical Alignment of Anisotropic Fillers Assisted by Expansion Flow in Polymer Composites

et al. 2022

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Orientation control of anisotropic one-dimensional (1D) and two-dimensional (2D) materials in solutions is of great importance in many fields ranging from structural materials design, the thermal management, to energy storage. Achieving fine control of vertical alignment of anisotropic fillers (such as graphene, boron nitride (BN), and carbon fiber) remains challenging. This work presents a universal and scalable method for constructing vertically aligned structures of anisotropic fillers in composites assisted by the expansion flow (using 2D BN platelets as a proof-of-concept). BN platelets in the silicone gel strip are oriented in a curved shape that includes vertical alignment in the central area and horizontal alignment close to strip surfaces. Due to the vertical orientation of BN in the central area of strips, a through-plane thermal conductivity as high as 5.65 W m−1 K−1 was obtained, which can be further improved to 6.54 W m−1 K−1 by combining BN and pitch-based carbon fibers. The expansion-flow-assisted alignment can be extended to the manufacture of a variety of polymer composites filled with 1D and 2D materials, which can find wide applications in batteries, electronics, and energy storage devices.

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“…[32][33][34] For example, high interfacial bindings with the double surfaces through metallization, covalent bonds, or non-covalent interactions demonstrate a more reliable thermal boundary conductance. [35][36][37][38][39] The robust interfacial interactions will also open up opportunities for credible out-of-plane conduction when the electronics are exposed to repeated bending, twisting, and stretching, which may be essential in potential applications of the next-generation soft and stretchable electronic devices. However, concerning current TIMs, high interfacial binding is seldom implemented to reduce R c , and their relationship lacks systematic research.…”

Section: Introductionmentioning

confidence: 99%

A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction

Guo

et al. 2022

Mater. Horiz.

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Thermally conductive, self-healing, and elastic Polyimide@Vertically aligned carbon nanotubes composite as smart thermal interface material

Cited by 150 publications

References 27 publications

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity

Vertical Alignment of Anisotropic Fillers Assisted by Expansion Flow in Polymer Composites

A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction

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