Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores

Su, Yuezeng; Fu, Guicui; Liu, Changqing; Zhang, Kun; Zhao, Liguo; Liu, Canyu; Liu, Allan; Song, Jingming

doi:10.1016/j.cma.2021.113729

Cited by 44 publications

(4 citation statements)

References 53 publications

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“…Pores in nano-silver are generally uniformly and randomly distributed [32,33]. Models with stochastic microporous structures could describe the material properties with randomness and statistically evaluate the ranges of the mechanical properties, allowing a better match with the reality [34]. Therefore, an algorithm was proposed to form defects inside the nano-silver.…”

Section: Modeling Algorithm and Finite Element Modelmentioning

confidence: 99%

Porosity effect on the mechanical properties of nano-silver solder

Lv¹,

Hu²,

Liu³

et al. 2023

Nanotechnology

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Nano-silver has the characteristics of low-temperature sintering and high-temperature service, which can reduce the thermal stress in the packaging process. Because of the high melting point and good high-temperature mechanical properties, silver is widely used in high-temperature packaging and connection fields. Sintered nano-silver has a porous structure on the microscopic level, so it is necessary to study the mechanical properties of nano-silver with porosity. In this paper, we proposed a method for finite element modeling of porous nano-silver. Finite element analysis and nanoindentation experiment were used to investigate the Young’s modulus of nano-silver. At the same time, and the quadratic equation of porosity and Young’s modulus was fitted, and it was verified by Ramakrishnan model and nanoindentation experiment. The results show that the Young’s modulus of nano-silver decreases with the increase of internal porosity, and the Young’s modulus and porosity show a quadratic function correlation. As the porosity increases, the Young’s modulus of nano-silver decreases at a slower rate. The modeling method presented in this paper can well predict the Young's modulus of nano-silver in interconnect structures.

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Section: Modeling Algorithm and Finite Element Modelmentioning

confidence: 99%

Porosity effect on the mechanical properties of nano-silver solder

Lv¹,

Hu²,

Liu³

et al. 2023

Nanotechnology

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“…These extreme operating conditions pose significant challenges to traditional interconnect materials [ 1 , 2 , 3 ]. Nano-silver paste, due to its exceptional properties such as a high melting temperature (961.8 °C), impressive thermal conductivity (200–300 W/(m·K)), and long-term durability, has emerged as a potential substitute for Sn/Pb solders in SiC or GaN power electronics [ 4 , 5 , 6 , 7 , 8 , 9 ]. For instance, power dissipation and ambient temperature alterations during the packaging, testing, and service processes subject electronic packaging and its components to a cyclical temperature effect [ 10 ].…”

Section: Introductionmentioning

confidence: 99%

A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading

Liu

Sun

et al. 2023

Materials

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Ag paste has been recognized as a promising substitute for Sn/Pb solder in SiC or GaN power electronic devices, owing to its ability to withstand high temperatures and facilitate low-temperature packing. The reliability of these high-power circuits is greatly influenced by the mechanical properties of sintered Ag paste. However, there exist substantial voids inside the sintered silver layer after sintering, and the conventional macroscopic constitutive models have certain limitation to describe the shear stress–strain relationship of sintered silver materials. To analyze the void evolution and microstructure of sintered silver, Ag composite pastes composed of micron flake silver and nano-silver particles were prepared. The mechanical behaviors were studied at different temperatures (0–125 °C) and strain rates (1 × 10−4–1 × 10−2) for Ag composite pastes. The crystal plastic finite element method (CPFEM) was developed to describe the microstructure evolution and shear behaviors of sintered silver at varied strain rates and ambient temperatures. The model parameters were obtained by fitting experimental shear test data to a representative volume element (RVE) model built on representative volume elements, also known as Voronoi tessellations. The numerical predictions were compared with the experimental data, which showed that the introduced crystal plasticity constitutive model can describe the shear constitutive behavior of a sintered silver specimen with reasonable accuracy.

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“…The shear strength of the sintered joints using flake paste measured 45 MPa, obviously superior to 30 MPa achieved with the sphere paste. Moreover, Su et al [5] reported a novel computational framework was proposed to generate the random micro-porous structures and simulate their effects on mechanical properties and fracture behaviour based on the one-cut gaussian random field model and the thermoelasto-plastic phase-field model. However, there are only a few studies related to CuNPs, especially their mechanical properties.…”

Section: Introductionmentioning

confidence: 99%

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Poelm³

et al. 2023

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and

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The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However, there are only a few studies with regard to the mechanical properties of sintered Cu. As the die-attach layer undergoes thermal and mechanical stress durin g its application, it is essential to investigate the micro-scale mechanical properties of sintered Cu. Fracture toughness is a measure of the resistance of a material to crack propagation under predominantly linear-elastic conditions, which is an essential para meter for predictin g fracture failure. As cracks and defects are difficult to avoid during fabrication and application processing for sintered Cu, which will defin itely cause a sign ificant effect on micromechanical properties. Thus, it is essential to reveal the effect of microstructure on fracture toughess of sintered Cu nanoparticles.

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Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores

Cited by 44 publications

References 53 publications

Porosity effect on the mechanical properties of nano-silver solder

Porosity effect on the mechanical properties of nano-silver solder

A Micromechanical Analysis to the Viscoplastic Behavior of Sintered Silver Joints under Shear Loading

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

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