Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies

Li, Xiaoyan; Wang, Zhisheng

doi:10.1016/j.jmatprotec.2006.09.010

Cited by 58 publications

(17 citation statements)

References 20 publications

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“…This section presents an FE model for UBM in micro-system packages, constructed by the proposed method. The dimensions and material properties employed in the model were derived from the literature [24,27]. A simple FE model without UBM and IMC layers has thus far been used for reliability analysis of micro system packages.…”

Section: Case Studymentioning

confidence: 99%

Modeling of time-variant heterogeneous objects in micro-system packages

Shin

2011

J Mech Sci Technol

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UBM (under bump metallurgy) of micro-system packages consists of several heterogeneous layers such as solder wetting, diffusion barrier, adhesion, and IMC (inter-metallic compound) layers. In particular, the IMC layer, formed between the solder wetting layer (e.g., Cu or Ni) and the solder, grows gradually and thus its composition changes with time (i.e., time-variant). The primary failure mechanism of the solder joints in micro-system packages is widely known as the fatigue failure caused by thermal fatigue and electro-migration damage. However, these phenomena have thus far been viewed from experimental investigations. Therefore, finite element analysis (FEA) becomes an important step for the optimal design and reliability analysis of heterogeneous objects such as in micro-system packages. However, the accuracy of the FEA wholly depends on the quality of finite element models. There thus exists an increasing need for generating finite element models adaptive to both geometric complexity and material distribution. In this sense, this paper presents a new method for modeling of time-variant heterogeneous objects such as in micro-system packages whose composition changes with time. Heterogeneous Boolean operators based on the diffusion process are proposed to construct time-variant heterogeneous objects. Once a time-variant heterogeneous solid model is constructed, it is then discretized into an object model onto which appropriate material properties are mapped. Discretization converts continuous material variations inside an object into stepwise variations. Next, the object model is adaptively meshed and converted into a finite element model. FEA using commercial software is finally performed to check failure criteria. An example (UBM in micro-system package) is shown to illustrate the entire modeling procedure.

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Section: Case Studymentioning

confidence: 99%

Modeling of time-variant heterogeneous objects in micro-system packages

Shin

2011

J Mech Sci Technol

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“…3 assures that a worst-case situation was simulated where two rows of bumps near die corners were modelled based on Darveaux's modified Anand's (Zahn, 2000). The explanations on solder joint fatigue life prediction methodology by Darveaux can be referred elsewhere (Xiaoyan and Wang, 2006;Darveaux, 2000).…”

Section: Underfill Materials Propertiesmentioning

confidence: 99%

Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

Kornain¹

2010

American Journal of Engineering and Applied Sciences

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Problem statement: This study mainly to study the effect of several commercial underfill materials to the reliability of HiCTE Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to Accelerated Thermal Cycling (ATC) effect. Approach: The warpage condition of package, die back stress, interfacial die shear stress, and solder bump fatigue for different commercial underfills were assessed and compared via a commercial Finite Element Analysis (FEA) under JEDEC Standard of ATC. The thermo-mechanical properties of underfills for simulation were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). The actual package of HiCTE FC-CBGA were assembled with those underfill materials and underwent ATC to be compared with FEA result. Results: The results from FEA and experimental were discussed to characterize the performance of each underfill material. The results of this study indicate that the underfill materials investigated, those with a glass transition temperature (Tg) and a Youngs modulus of approximately above 105°C and 8-9 GPa, respectively, were appropriate for HiCTE FC-CBGA with high lead solder bumps. Conclusion: The result from FEA analysis and ATC reliability test found that the underfill materials with high and medium low Youngs modulus has high reliability in FC-CBGA package

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“…If solder bumps are deformed, the flip-chip is therefore fault. The main problem of solder bumps is that they are often improperly melted in the melt process due to many factors [1][2][3][4]. In this study, solder bump position will be investigated how it affects deformation of solder bumps.…”

Section: Modelmentioning

confidence: 99%

“…The results showed that the bump outline shape must be considered in creep experiments and results of the experiment and simulation were similar. X. Li and Z. Wang [3] also investigated the thermo-fatigue life evaluation of SnAgCu solder joints by FEM. The solder bump life model predicated according to accumulated creep strain was shown higher value than the model predicate according to accumulated creep strain energy density.…”

Section: Introductionmentioning

confidence: 99%

Analysis of solder bump position affecting stress performance by the finite element method

Ruangsinchaiwanich

Nakem

Intachai

2008

2008 IEEE Vehicle Power and Propulsion Conference

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Due to the smaller size of HDD, fault deformation of solder bumps is found more often. In order to study about a factor relating to fault deformation of solder bumps, the FEM is used to investigate stress performance. The results show that a small number of bumps positioned in a symmetric form have similar stress while a small number of bumps positioned in the asymmetric form have different stress. The results also show that a large number of bumps positioned in the symmetric form also have different stress. Bumps positioned at the corner have highest stress while bumps positioned at the center have lowest stress. The FEM and analytical method are found to be suitable for this study.

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Thermo-fatigue life evaluation of SnAgCu solder joints in flip chip assemblies

Cited by 58 publications

References 20 publications

Modeling of time-variant heterogeneous objects in micro-system packages

Modeling of time-variant heterogeneous objects in micro-system packages

Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

Analysis of solder bump position affecting stress performance by the finite element method

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