Thermodynamic database of the phase diagrams in copper base alloy systems

Wang, C.P.; Liu, X.J.; Jiang, Min; Ohnuma, Ikuo; Kainuma, Ryosuke; Ishida, K.

doi:10.1016/j.jpcs.2004.08.037

Cited by 53 publications

(35 citation statements)

References 10 publications

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“…However, phase diagrams obtained from thermodynamic modeling 51,52,53 by considering both the chemical (non-magnetic) and magnetic terms of the Gibbs energy indicate that below about 630 K there is a miscibility gap also in the Ni-Cu system. This maximum decomposition temperature was calculated for 67.3…”

Section: Influence Of Magnetic Layer Composition On Magnetoresistancementioning

confidence: 99%

Magnetoresistance and Structural Study of Electrodeposited Ni-Cu/Cu Multilayers

Fesharaki

Péter

Schucknecht

et al. 2012

J. Electrochem. Soc.

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-Electrodeposition was used to produce Ni-Cu/Cu multilayers by two-pulse plating (galvanostatic/potentiostatic control) from a single sulfate/sulfamate electrolyte at an optimized Cu deposition potential for the first time. Magnetoresistance measurements were carried out at room temperature for the Ni-Cu/Cu multilayers as a function of the Ni-Cu and Cu layer thicknesses and the electrolyte Cu 2+ ion concentration. Multilayers with Cu layer thicknesses above 2 nm exhibited a giant magnetoresistance (GMR) effect with a dominating ferromagnetic contribution and with low saturation fields (below 1 kOe). A significant contribution from superparamagnetic (SPM) regions with high saturation fields occurred only for very small nominal magnetic layer thicknesses (around 1 nm). The presence of SPM regions was concluded from the GMR data also for thick magnetic layers with high Cu contents. This hints at a significant phase-separation in Ni-Cu alloys at low-temperature processing, in agreement with previous theoretical modeling and experiments. Lowtemperature measurements performed on a selected multilayer down to 18 K indicated a strong increase of the GMR as compared to the room-temperature GMR. Structural studies of some multilayer deposits exhibiting GMR were performed by X-ray diffraction (XRD) and transmission electron microscopy (TEM). The XRD patterns of Ni-Cu/Cu multilayers exhibited in most cases clear satellite peaks, indicating a superlattice structure which was confirmed also by cross-sectional TEM. The deterioration of the multilayer structure revealed by XRD for high Cu-contents in the magnetic layer confirmed the phase-separation concluded from the GMR data.

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Section: Influence Of Magnetic Layer Composition On Magnetoresistancementioning

confidence: 99%

Magnetoresistance and Structural Study of Electrodeposited Ni-Cu/Cu Multilayers

Fesharaki

Péter

Schucknecht

et al. 2012

J. Electrochem. Soc.

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“…Liu). the framework of the CALPHAD method [15][16][17][18][19][20][21], which is important for the design and development of Cu-based alloys. As a part of development of the thermodynamic database of Cubased alloys, the purpose of the present work is to present the thermodynamic assessment of the Cu-Mn binary system as well as the Cu-Mn-Fe and Cu-Mn-Co ternary systems based on the available experimental data.…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic assessments of the Cu–Mn–X (X: Fe, Co) systems

Wang

Liu

Ohnuma

et al. 2007

Journal of Alloys and Compounds

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“…preventing diffusion of Cu and Au across the barrier), but that they reduce Cu related degradation by other mechanisms involving Ni diffusion and/or intermixing processes within the contact layer structure. Insight in these processes that ultimately reduce or prevent cell degradation in the AAT times relevant for the anticipated application can be obtained by combining the TEM analysis of the current and previous 20 study with information from (Cu, Ni, Au, Ga, As) phase diagrams reported in literature [44][45][46][47][48][49][50] . From these phase diagrams it can be concluded that (even at room temperature) Cu/Au, Cu/Ni, Ni/Au and Cu/GaAs interfaces are unstable, while Au/GaAs interfaces are stable.…”

Section: Barrier Mechanismmentioning

confidence: 99%

“…Both these interfaces are unstable [48][49][50] thus intermixing is likely to occur. From the TEM images of the cells with 100 nm thick Ni barriers after AAT (figures 7c and 8c) it can be deduced that intermixing of Au and Ni dominates as the top and bottom edges of the intermixed Ni/Au/Cu layer appear to coincide with the original Au/GaAs and Ni/Cu interfaces.…”

Section: Barrier Mechanismmentioning

confidence: 99%

Metal diffusion barriers for GaAs solar cells

Leest¹,

Mulder²,

Bauhuis³

et al. 2017

Phys. Chem. Chem. Phys.

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In this study accelerated ageing testing (AAT), J-V characterization and TEM imaging in combination with phase diagram data from literature are used to assess the potential of Ti, Ni, Pd and Pt as diffusion barriers for Au/Cu-based metallization of III-V solar cells. Ni barriers show the largest potential as at an AAT temperature of 250 • C both cells with 10 and 100 nm thick Ni barriers show significantly better performance compared to Au/Cu cells, with the cells with 10 nm Ni barriers even showing virtually no degradation after 7.5 days at 250 • C (equivalent to 10 years at 100 • C at an E a of 0.70 eV). Detailed investigation shows that Ni does not act as a barrier in the classical sense, i.e. preventing diffusion of Cu and Au across the barrier. Instead Ni modifies or slows down the interactions taking place during device degradation and thus effectively acts as an 'interaction' barrier. Different interactions occur at temperatures below and above 250 • C and for thin (10 nm) and thick (100 nm) barriers. The results of this study indicate that 10-100 nm thick Ni intermediate layers in the Cu/Au based metallization of III-V solar cells may be beneficial to improve the device stability upon exposure to elevated temperatures.

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Thermodynamic database of the phase diagrams in copper base alloy systems

Cited by 53 publications

References 10 publications

Magnetoresistance and Structural Study of Electrodeposited Ni-Cu/Cu Multilayers

Magnetoresistance and Structural Study of Electrodeposited Ni-Cu/Cu Multilayers

Thermodynamic assessments of the Cu–Mn–X (X: Fe, Co) systems

Metal diffusion barriers for GaAs solar cells

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