Thick‐film Fine‐line Fabrication Techniques — Application to Front Metallisation of Solar Cells

Dziedzic, Andrzej; Nijs, J.; Szlufcik, Jozef

doi:10.1108/eb044486

Cited by 8 publications

(7 citation statements)

References 5 publications

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“…Miniaturization of multilayer components, fabricated either by the widely used tape casting and lamination process or the wet building process used here, is limited due to resolution in patterning of the internal electrodes, vertical alignment of internal electrode patterns, and cutting out single components with required precision. Using screen printing to pattern the internal electrodes, the line spacing achieved in production is usually no better than 100 µm and the finest line spacing achievable is about 50 µm [20]. Spreading in the electrode edge position due to tolerances in edge definition in screen printing also contributes to the measured alignment error.…”

Section: Discussionmentioning

confidence: 99%

Fabrication of monolithic piezoelectric drive units for a miniature robot

Simu

Johansson

2002

J. Micromech. Microeng.

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In this paper, we present the design and assembly of a miniature robot, with a size of a few cm 3 , which should be able to move freely over distances in the centimetre range performing high precision manipulating operations on micrometre-sized objects with a precision in the nanometre range. The final robot will carry an application specific integrated circuit containing power drivers and a digital control system with a fast serial interface protocol. Two six-legged monolithic piezoelectric drive units generate the motion. Each leg is a three-axial multilayer piezoceramic enabling a five-axial manipulation operation. The fabrication of the drive units is described in detail. The multilayer structures are fabricated with wet building and screen printing. The green material is machined to single components using a high precision CNC micromilling machine. The motion capacity of the legs has been evaluated and major limitations restraining the motion capacity and further miniaturization have been identified. Firstly, the patterning of the internal electrodes should be improved, but also the milling operation has to be considered.

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Section: Discussionmentioning

confidence: 99%

Fabrication of monolithic piezoelectric drive units for a miniature robot

Simu

Johansson

2002

J. Micromech. Microeng.

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“…Other researchers, e.g. Dziedzic et al [12] advanced and extended the original technique in the field of inkjet-based solar cell fabrication.…”

Section: Reviewmentioning

confidence: 99%

Comparative Reliability of Inkjet-Printed Electronics Packaging

Tilford

Stoyanov

Braun

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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This paper compares the thermomechanical behavior of 3D inkjet printed microelectronics devices relative to those fabricated from traditional methods. It discusses the benefits and challenges in the adoption of additive manufacturing methods for microelectronics manufacture relative to conventional approaches. The critical issues related to the design and reliability of additively manufactured parts and systems stem from the change in the manufacturing process and the change in materials utilized. This study uses numerical modelling techniques to gain insight into these issues. This article is an extension of a paper on the same topic presented at the 2018 IEEE Electronics Packaging Technology Conference [1]An introduction providing an overview of the area, covering salient academic research activities and discussing progress towards commercialization is presented. The state-of-the-art modular microelectronics fabrication system developed within the EU NextFactory project is introduced. This system has been used to manufacture several test samples, which were assessed both experimentally and numerically. A full series of JEDEC tests showed that the samples were reliable, successfully passing all tests.The numerical model assessing the mechanical behavior of an inkjet-printed structure during layer-by-layer fabrication is presented. This analysis predicts that the stresses induced by the UV cure process are concentrated toward the extremities of the part and, in particular, in the lower layers which are constrained by the print platform.Subsequently, a model of a multilayer microelectronics structure undergoing JEDEC thermal cycling is presented. The model assesses the differences in mechanical properties between a conventional FR4/copper structure and an inkjet-printed acrylic/silver structure. The model identified that the influence of the sintering process on subsequent material properties, behavior of the inject-printed structure, and reliability of the inject-printed structure is significant.Key findings are that while stresses in the conventional and inkjet boards are relatively similar, the inkjet-printed board exhibits significantly greater deformation than the standard board. Furthermore, the mechanical stresses in the inkjet fabricated board are strongly dependent on the elastic modulus of the sintered silver material, which, in turn, is dependent on the sintering process.

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“…For metallization, several alternatives to screen printing are available to improve cell efficiency [22,23]. However, the existing screen printing technology is the matured and cost effective technology [24,25] compared to recently developed technologies such as PERC, IBC, and HIT. Hence, around 85% of Si solar cells are manufactured using screen printing of thick film pastes.…”

Section: Conventional Si Solar Cellmentioning

confidence: 99%

Review on Metallization in Crystalline Silicon Solar Cells

Balaji¹,

Raval²,

Saravanan³

2020

Solar Cells

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Solar cell market is led by silicon photovoltaics and holds around 92% of the total market. Silicon solar cell fabrication process involves several critical steps which affects cell efficiency to large extent. This includes surface texturization, diffusion, antireflective coatings, and contact metallization. Among the critical processes, metallization is more significant. By optimizing contact metallization, electrical and optical losses of the solar cells can be reduced or controlled. Conventional and advanced silicon solar cell processes are discussed briefly. Subsequently, different metallization technologies used for front contacts in conventional silicon solar cells such as screen printing and nickel/copper plating are reviewed in detail. Rear metallization is important to improve efficiency in passivated emitter rear contact cells and interdigitated back contact cells. Current models on local Al contact formation in passivated emitter rear contact (PERC) cells are reviewed, and the influence of process parameters on the formation of local Al contacts is discussed. Also, the contact mechanism and the influence of metal contacts in interdigitated back contact (IBC) cells are reviewed briefly. The research highlights on metallization of conventional screen printed solar cells are compared with PERC and IBC cells.

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Thick‐film Fine‐line Fabrication Techniques — Application to Front Metallisation of Solar Cells

Cited by 8 publications

References 5 publications

Fabrication of monolithic piezoelectric drive units for a miniature robot

Fabrication of monolithic piezoelectric drive units for a miniature robot

Comparative Reliability of Inkjet-Printed Electronics Packaging

Review on Metallization in Crystalline Silicon Solar Cells

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