Thin film compound phase formation sequence: An effective heat of formation model

Pretoriüs, R.; Marais, T.; Theron, C.C.

doi:10.1016/0920-2307(93)90003-w

Cited by 131 publications

(81 citation statements)

References 200 publications

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“…As a result, Al 3 Ni or a mixture of Al 3 Ni and Al solid solution in Ni were formed. It was reported [24,27,29,[45][46][47] that the manufacturing process parameters, such as the build-up of the stacked sandwich sample, the strain levels, and ensuing defect concentration, alter the phase formation sequence and their growth kinetics. Although further verification is required to clarify the effect of these parameters in a comprehensive manner, a large number of reports have confirmed that the first kinetically favored intermetallic phase is the Al 3 Ni compound.…”

Section: Atomic Diffusivity Observationsmentioning

confidence: 99%

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

Azimi

Toroghinejad

Shamanian

et al. 2017

Metals

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Abstract:In the present work, the influence of strain on phase formation at the Al/Ni interface was investigated during cold roll bonding and annealing. A sandwich sample composed of an Al-Ni-Al stack was cold rolled with reductions in the range of 50% to 90%, followed by annealing at 450 • C for 60 min. The crystallography of the annealed sandwich samples was analyzed by XRD (X-ray diffraction), whereas the microstructure was studied by scanning electron microscopy, equipped with EDS (energy dispersive spectrometer) analysis, and optical microscope. In the annealed samples, the intermetallic phase Al 3 Ni has formed at the Ni/Al interface, preferentially on the Al side of the interface. It is found that the applied strains did not have an effect on the type of intermetallic phase that was formed. However, the rolling reduction has a significant effect on the morphology of the intermetallic layer, as it was observed that after the lowest reduction of 50% only some scattered intermetallic nuclei were present, whereas at the highest rolling reduction of 90% a continuous intermetallic layer of 4.1 µm was exhibited. The formation of the intermetallic layer is discussed in terms of Al and Ni diffusion at the interface and irregular nature of the Al/Ni bonded interface after rolling reductions.

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Section: Atomic Diffusivity Observationsmentioning

confidence: 99%

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

Azimi

Toroghinejad

Shamanian

et al. 2017

Metals

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“…14, 15 If sufficient layer of Ge is present the reaction continues to form TiGe 2 . To clarify further the EHF model, Pretorius et al 16 indicate that two groups can be distinguished: a) reactions between metal and silicon and b) reactions between metal and metal. In a) the predicted first phase to form is the congruently melting phase which characterizes the silicide phases.…”

Section: Discussionmentioning

confidence: 99%

A note on the reactions in the Ti-Ge system

Eliahu

Barkai²,

Lévi³

2012

AIP Advances

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Formations of germanides in thin films of the Ti-Ge system were investigated by XRD after furnace annealing for 1 hour. Ti6Ge5 seems to be the first phase formed while TiGe2 is the end phase with the lowest resistivity. The existence of the phase Ti5Ge3 was confirmed which forms at higher temperatures than Ti6Ge5. The presence of a thin TiO2 layer was observed by TEM. Which of the phase exists or is missed depends on composition of the constituents comprising the film, their thickness and temperature of reaction. Three phases are observed to coexist on the Ge substrate, which are Ti5Ge3, Ti6Ge5 and TiGe2. A schematic suggestion is presented for explaining the coexistence of two or more phases. The concept of formation and coexistence of two phases at lower temperatures is also proposed

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“…13) In these cases, instead of the formation energy "G f , the formation enthalpy "H f at 298 K is used since "H f at 298 K is more easily available in the literatures for many intermetallic compound phases and this approximation is also successful in other first intermetallic compound phase predictions. 11,1921) Therefore, in this paper, the products r"H f are compared for intermetallic compound phase formation in MDR diagrams explained in the next section. Because intermetallic compound phases formed at the reaction temperature (613, 653 and 673 K), "H f of the exact reaction temperature should be utilized to draw MDR diagrams ideally.…”

Section: Model For Intermetallic Compound Phase Formationmentioning

confidence: 99%

“…For instance, ¾-CuZn 4 is predicted as a major phase at (eutectic Sn-8.8 mass%Zn)/Cu diffusion couple, 8) but £-Cu 5 Zn 8 is observed as the first phase or ¾-CuZn 4 cannot be seen from experimental results in the literature. 8,10) Hence, there have been several attempts using above thermodynamic calculations to predict the first intermetallic compound phase or intermetallic compound formation sequence by comparing driving forces of homogeneous nucleation of intermetallic compound phases, 7,8) activation energies for homogeneous nucleation of intermetallic compound phases, 9) effective heat of formation of an intermetallic compound phase (EHF model), 11) or by applying modified Jonson-Mehl-Avrami-Kolmogorov kinetic equation for precipitation.…”

Section: Introductionmentioning

confidence: 99%

Prediction of Intermetallic Compound Formation Sequences in Pseudo Binary Diffusion Couples: Experimental Examinations for (Sn-<i>x</i>Zn)/Cu (<i>x</i> = 2, 5, 10, 15, 20 and 25 mass%) by a Kinetic Model with Thermodynamic Data Using MDR Diagram

Terashima

Sasaki

2014

Mater. Trans.

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A kinetic model based on the principle of maximum degradation rate of the total system free energy, MDR law, using thermodynamic data is applied to (Sn-Zn)/Cu diffusion couples to predict intermetallic compound phases and their order to be formed. According to this model, only £-Cu 5 Zn 8 is predicted to appear when Zn content is less than 10 mass%, while both £-Cu 5 Zn 8 and ¾-CuZn 4 can exist with 10 mass%Zn or more, which was in a good agreement with EPMA and TEM observations of Cu plates dipped into Sn-Zn baths. Therefore, it is concluded that the phase prediction based on the MDR law can also be applied to pseudo binary diffusion systems.

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Thin film compound phase formation sequence: An effective heat of formation model

Cited by 131 publications

References 200 publications

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

The Effect of Strain on the Formation of an Intermetallic Layer in an Al-Ni Laminated Composite

A note on the reactions in the Ti-Ge system

Prediction of Intermetallic Compound Formation Sequences in Pseudo Binary Diffusion Couples: Experimental Examinations for (Sn-<i>x</i>Zn)/Cu (<i>x</i> = 2, 5, 10, 15, 20 and 25 mass%) by a Kinetic Model with Thermodynamic Data Using MDR Diagram

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