“…This technology [15][16][17] provides an independent control of energy and particles flux (ions, atoms) on the surfaces immersed in the plasma chamber (targets and substrates), thanks to the complete de-coupling between the plasma parameters (power supply, gas pressure) and the bias voltages applied to the surfaces. This operating flexibility allows handling both the chemical composition and microstructure, and implicitly the thermoelectric performance, of the deposited layers.…”