Time dependent measurements of induced fission for SNM interrogation

Beck, A.; Israelashvili, I.; Wengrowicz, U.; Caspi, E. N.; Yaar, I.; Osovizki, A; Ocherashvili, A.; Rennhofer, H.; Pedersen, B.; Crochemore, J.-M.; Roesgen, E.

doi:10.1088/1748-0221/8/08/p08011

Cited by 5 publications

(1 citation statement)

References 8 publications

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“…SiPM sensors are now used in a variety of applications including Medical Imaging [3]- [7] , Hazard and Threat Detection [8]- [10] , 3D ranging or Light Detection and Ranging (LIDAR) and Biophotonics [11]- [13] . These applications require a device that designed for mass production, with high performance and reliability.…”

Section: Introductionmentioning

confidence: 99%

Ultra-low noise and exceptional uniformity of SensL C-series SiPM sensors

et al. 2015

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SensL C-Series Silicon Photomultiplier (SiPM) sensors are fabricated in a high-volume CMOS foundry to a custom SensL process, and packaged as a reflow solderable surface mount device. Advances in SiPM production have resulted in significant improvement in PDE, dark current as well as tighter breakdown voltage uniformity for the C-Series SiPM sensors. The SiPM are fabricated with a shallow P-on-N junction optimized for the detection of shorter wavelength photons, with a peak PDE of 41% at 420nm and excellent sensitivity extending to wavelengths <300nm. The dark currents have been reduced through the reduction of damage during semiconductor processing and an order of magnitude reduction has been achieved. The breakdown voltage variation has been improved through process optimization to minimize variations. With these process improvements typical dark count rates of ~30kHz/mm 2 are achieved simultaneously with breakdown voltage uniformity of ±213mV demonstrated. In addition, application specific measurements of CRT (Coincidence Resolving Time) that are relevant to PET (positron emission tomography) will be shown to be 210ps at 7.5V overvoltage. In addition to device characterization work, this paper will address the waferlevel fabrication and testing, package level testing required by high volume SiPM sensor applications.

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