Time-domain simulation of multiconductor transmission lines with frequency-dependent losses

Gordon, C.; Blazeck, T.; Mittra, R.

doi:10.1109/43.177401

Cited by 41 publications

(13 citation statements)

References 19 publications

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“…Convolution of the impulse response of the linear circuit with the outputs of the nonlinear elements has been proposed for transient analysis of distributed circuits with [1]- [4], [6], [7], and [19]. The major problem identified with this type of analysis is the rapid growth in computation and memory requirements.…”

Section: Convolutionmentioning

confidence: 99%

State-variable-based transient analysis using convolution

Christoffersen

Ozkar²,

Steer³

et al. 1999

IEEE Trans. Microwave Theory Techn.

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Section: Convolutionmentioning

confidence: 99%

State-variable-based transient analysis using convolution

Christoffersen

Ozkar²,

Steer³

et al. 1999

IEEE Trans. Microwave Theory Techn.

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“…This optimization is constrained by (32) (33) 6 Convolutions are symbolized by ?. 7 The matrix element in row i and column k is selected by (1) ik : to ensure stability. For stationary accuracy, we require the model to match the data at exactly 8…”

Section: Broadband Rational Function Approximationmentioning

confidence: 99%

“…The latter drawback was overcome by Gordon et al by introducing recursive convolution enabled through time-domain approximation of the transmission-line responses with exponential series [7]. However, they still had to perform the inverse Fourier transformations numerically-a burden that was eliminated by Lin and Kuh with the help of Padé approximation of the frequency-domain transfer functions after modal delay separation [8].…”

Section: Introductionmentioning

confidence: 99%

Time-domain simulation of large lossy interconnect systems on conducting substrates

Braunisch

Grabinski²

1998

IEEE Trans. Circuits Syst. I

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The most general class of uniform transmission-line systems is considered, assuming that samples of the frequencydependent parameter matrices R R R; L L L; G G G, and C C C are given. In particular, substrate effects which influence wave propagation along integrated circuits (IC) interconnects typically over a very broad range of frequencies are included. A time-domain simulation technique which can handle this problem is described in detail. The algorithm can be embedded in general-purpose circuit simulators and is based on modal analysis, mode tracking, modal delay separation, broadband rational function leastsquares approximation directly in partial fraction form, and recursive convolution. A numerical example for realistic geometry and material parameters of the examined transmissionline structure shows the significance of substrate effects in the frequency and-more important-in the time domain.

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“…Assuming a loss-less interconnect on a chip, the characteristic impedance and inductance can be derived from interconnect capacitance based on the following relationships [6],…”

Section: Propagation Delay Modelmentioning

confidence: 99%

“…The propagation model has been developed based on a new simplified analytical formula for the pulse response of a transmission-line [6]. The subdesign-chart with tdll.…”

Section: Propagation Delay Modelmentioning

confidence: 99%

A new characterization of sub-μm parallel multilevel interconnects and experimental verification

Aoyama

Ise

Sato

et al. 1996

IEEE Trans. Semicond. Manufact.

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This paper describes the generation of a new universal design chart for submicron multilevel interconnection and its verification using test-structures. This has been developed to give the precise interconnect-capacitance for parallel submicron multilevel interconnections. Parasitic effects of a passivation film (Si3 N4) on the interconnect capacitance have been also studied. The results of the test-structures designed have shown an excellent agreement with the design-chart with a maximum error of 8%. Furthermore, a simple propagation delay and response voltage model to a step voltage input have been developed incorporating the parallel-interconnect capacitance model. The new model is based on a lossy-transmission line equation and demonstrates an excellent agreement with RC lumped circuit simulations, resulting in a new simple and accurate prediction method for interconnect delay for use in VLSI timing design.

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Time-domain simulation of multiconductor transmission lines with frequency-dependent losses

Cited by 41 publications

References 19 publications

State-variable-based transient analysis using convolution

State-variable-based transient analysis using convolution

Time-domain simulation of large lossy interconnect systems on conducting substrates

A new characterization of sub-μm parallel multilevel interconnects and experimental verification

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