Time scale matching of dynamically operated devices using composite thermal capacitors

Green, Craig E.; Fedorov, Andrei G.; Joshi, Yogendra

doi:10.1016/j.mejo.2014.05.013

Cited by 14 publications

(7 citation statements)

References 22 publications

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“…A heat sink, or thermal management device, made of PCM can absorb large heat spikes while maintaining a constant temperature. [47][48][49][50][51][52] This has been an active area of research for additive manufacturing, which excels at creating optimized extended surfaces for both traditional and PCM-based heat sinks. [53,54] Also, many products must stay below a maximum allowable temperature, and PCM integration can extend how long such sensitive goods can stay viable for transport purposes.…”

Section: Thermal Energy Storage Applicationsmentioning

confidence: 99%

Advanced Materials and Additive Manufacturing for Phase Change Thermal Energy Storage and Management: A Review

Freeman

Foster

Troxler

et al. 2023

Advanced Energy Materials

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Phase change materials (PCMs) can enhance the performance of energy systems by time shifting or reducing peak thermal loads. The effectiveness of a PCM is defined by its energy and power density-the total available storage capacity (kWh m −3 ) and how fast it can be accessed (kW m −3 ). These are influenced by both material properties as well as geometry of the energy systems; however, prior efforts have primarily focused on improving material properties, namely, maximizing latent heat of fusion and increasing thermal conductivity. The latter is often at the expense of the former. Advanced manufacturing techniques hold tremendous potential to enable co-optimization of material properties and device geometry, while potentially reducing material waste and manufacturing time. There is an emerging body of research focused on additive manufacturing of PCM composites and devices for thermal energy storage (TES) and thermal management. In this article, the fundamentals and applications of PCMs are reviewed and recent additive manufacturing advances in latent heat TES for both the PCM composite and associated heat exchanger are discussed. A forward-looking perspective on the future and potential of PCM additive manufacturing for TES and thermal management is provided.

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Section: Thermal Energy Storage Applicationsmentioning

confidence: 99%

Advanced Materials and Additive Manufacturing for Phase Change Thermal Energy Storage and Management: A Review

Freeman

Foster

Troxler

et al. 2023

Advanced Energy Materials

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“…The concept of employing PCMs for cooling applications in electronics has been established in research over the recent years [ 9 , 10 , 11 , 12 , 13 ]. These previous ideas aim at encapsulating PCMs in a container or cavity that is directly thermally coupled to the electronic component.…”

Section: Fundamentalsmentioning

confidence: 99%

“…Advantages of this concept are the large amount of PCM that can be used and the fixture of the liquid material. Green et al [ 13 ] encapsulate a small amount of PCM in a wafer level chip cavity to extend the duty cycle of switching applications.…”

Section: Fundamentalsmentioning

confidence: 99%

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

2017

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Modern high power electronics devices consists of a large amount of integrated circuits for switching and supply applications. Beside the benefits, the technology exhibits the problem of an ever increasing power density. Nowadays, heat sinks that are directly mounted on a device, are used to reduce the on-chip temperature and dissipate the thermal energy to the environment. This paper presents a concept of a composite coating for electronic components on printed circuit boards or electronic assemblies that is able to buffer a certain amount of thermal energy, dissipated from a device. The idea is to suppress temperature peaks in electronic components during load peaks or electronic shorts, which otherwise could damage or destroy the device, by using a phase change material to buffer the thermal energy. The phase change material coating could be directly applied on the chip package or the PCB using different mechanical retaining jigs.

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“…The optimum relative content of PCM is in the range 30-50%, considering the trade-off between response time delay due to PCM melting and thermal conductivity of overall composite structure [27,32,33]. Another application of PCM with metallic structure is directly in the Si chip substrate for transient applications of 500 W/cm 2 for up to 100 ms [34]. Furthermore, another solution for limiting the junction temperature for OCs of 150 ms is presented in [35] by combining the concept of double-sided cooling and using PCM with metallic structure for a press-pack IGBT module.…”

Section: Introductionmentioning

confidence: 99%

Over-Current Capability of Silicon Carbide and Silicon Devices for Short Power Pulses with Copper and Phase Change Materials below the Chip

Bhadoria,

Dijkhuizen,

Zhang

et al. 2024

Energies

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An increasing share of fluctuating and intermittent renewable energy sources can cause over-currents (OCs) in the power system. The heat generated during OCs increases the junction temperature of semiconductor devices and could even lead to thermal runaway if thermal limits are reached. In order to keep the junction temperature within the thermal limit of the semiconductor, the power module structure with heat-absorbing material below the chip is investigated through COMSOL Multiphysics simulations. The upper limits of the junction temperature for Silicon (Si) and Silicon Carbide (SiC) are assumed to be 175 and 250 ∘C, respectively. The heat-absorbing materials considered for analysis are a copper block and a copper block with phase change materials (PCMs). Two times, three times, and four times of OCs would be discussed for durations of a few hundred milliseconds and seconds. This article also discusses the thermal performance of a copper block and a copper block with PCMs. PCMs used for Si and SiC are LM108 and Lithium, respectively. It is concluded that the copper block just below the semiconductor chip would enable OC capability in Si and SiC devices and would be more convenient to manufacture as compared to the copper block with PCM.

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Time scale matching of dynamically operated devices using composite thermal capacitors

Cited by 14 publications

References 22 publications

Advanced Materials and Additive Manufacturing for Phase Change Thermal Energy Storage and Management: A Review

Advanced Materials and Additive Manufacturing for Phase Change Thermal Energy Storage and Management: A Review

Thermal Peak Management Using Organic Phase Change Materials for Latent Heat Storage in Electronic Applications

Over-Current Capability of Silicon Carbide and Silicon Devices for Short Power Pulses with Copper and Phase Change Materials below the Chip

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