2014
DOI: 10.1016/j.apsusc.2014.10.011
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Tin surface segregation, desorption, and island formation during post-growth annealing of strained epitaxial Ge1−xSnx layer on Ge(001) substrate

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Cited by 48 publications
(31 citation statements)
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“…Li et al reported that a Sn-rich surface layer would form when Ge 0.922 Sn 0.078 is annealed at 620°C [23]. A similar phenomenon occurs on Ge 0.915 Sn 0.085 surface after annealing at 500°C [24]. For Sn composition as high as 17%, self-assembled Sn wires can form at an annealing temperature as low as 280°C [25].…”
Section: Introductionmentioning
confidence: 87%
“…Li et al reported that a Sn-rich surface layer would form when Ge 0.922 Sn 0.078 is annealed at 620°C [23]. A similar phenomenon occurs on Ge 0.915 Sn 0.085 surface after annealing at 500°C [24]. For Sn composition as high as 17%, self-assembled Sn wires can form at an annealing temperature as low as 280°C [25].…”
Section: Introductionmentioning
confidence: 87%
“…Therefore, Sn atoms often precipitate in a GeSn(Si) layer and segregate on a GeSn(Si) surface during deposition and annealing after GeSn(Si) layer formation (referred to as PDA) [20, 21, 94]. Furthermore, high deposition temperatures and PDA at high temperatures induce Sn desorption from the surface [20, 21, 95].…”
Section: Heterostructures Interfaces and Defect Propertiesmentioning
confidence: 99%
“…For practical applications in optoelectronic and electric devices, the thermal stability of Ge 1−x Sn x material is a crucial property which has been widely studied and reported [17,23,24,[41][42][43][44][45]. Zaumseil et al showed that the tin segregation temperature of Ge 1−x Sn x alloys increases with decreasing Sn content, and that Ge 0.91 Sn 0.09 was stable at temperatures up to 400°C [17].…”
Section: Resultsmentioning
confidence: 99%