Tomorrow’s Packaging – Chip Scale Packaging vs Flip Chip

Abstract

The electronics packaging industry is debating whether CSP, Chip Scale Packaging, or flip chip is going to become the major alternative for future products. The user wants more functionality and portability at an ever increasing speed and the need for denser packaging is becoming urgent. The issue of acquiring adequate circuit boards is pressing. However, the comparison between CSP and flip chip is not straightforward, since many CSPs are really flip chips in small packages. CSPs therefore, do not compare with flip chip on board but with packaged die.

Flip-chip alignment with a dual imaging system using a visual servoing method

“…In zoom lens, the distance c between the object and the image is constant, which equals to 1 From Equation (5) and Equation (6), the relation between magnification and focal length is defined as following equation. 2 ( 1)…”

“…In Figure 3, b is the distance between center of the lens and the CCD. The lengths of the optical path from center of lens to flip-chip and substrate are expressed by 1 …”

“…Especially, flip-chip is the smallest packaging which is possible to make [1]. This method uses solder bumps to connect flip-chip with pads on the substrate which face each other.…”

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

“…Another reason is the increased availability of the lower-cost bonding and encapsulation materials, bumped bare dies, substrate, and equipment. Also, besides the C4 process, other processes have been developed (Lau, 1995;Zhong et al, 1997;Boustedt and Vardaman, 1997;Lyn et al, 1997;Kloeser et al, 1997;Johnson et al, 1997;Neiro et al, 1997;Beddingfield, 1997;Jimarez et al, 1997;Schiebel, 1997;Riley, 1997;Savolainen, 1998).…”