1997 IEEE Radiation Effects Data Workshop NSREC Snowmass 1997. Workshop Record Held in Conjunction With IEEE Nuclear and Space
DOI: 10.1109/redw.1997.629805
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Total ionizing dose effects on 64 Mb 3.3 V DRAMs

Abstract: 64Mb 3.3V CMOS DRAMs fromtwo different manufacturers were tested for total dose. Retention time, power supply current, and functionality were used to characterize device response. Burned-in devices failed functionally at lower total dose levels, Results showed that these :scaled DRAMs are about twice as hard as older generation 16M b commercial DRAMs.

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Cited by 2 publications
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“…In the reversed-biased depletion region, carrier generation due to displacement damage can increase the leakage current characteristics of affected bits, and this increase in the leakage current can contribute to destruction of the data stored in the corresponding bit cells [20]. The above mentioned damages can be recovered by high temperature annealing [16], [17].…”
Section: Introductionmentioning
confidence: 99%
“…In the reversed-biased depletion region, carrier generation due to displacement damage can increase the leakage current characteristics of affected bits, and this increase in the leakage current can contribute to destruction of the data stored in the corresponding bit cells [20]. The above mentioned damages can be recovered by high temperature annealing [16], [17].…”
Section: Introductionmentioning
confidence: 99%