“…[1][2][3][4][5] However, their shortcomings, such as poor thermal degradation stability and the nature of brittleness, prevent their application from further expanding. Therefore, in order to obtain high-performance cured products of epoxy resin, which possess both the favorable thermal stability and toughness, a great deal of scientific researches have been conducted, such as physical blend method, 6,7 synthesis of new type epoxy resin, 8,9 addition of a flexible material into the epoxy matrix, 10,11 and preparation of chemically modified epoxy resin. 12,13 Among numerous the approaches attempting to improve the thermal stability and fracture toughness of epoxy resin, introduction of organosilicone into the epoxy resin network [14][15][16] have drawn much attention and turned out to be effective, because silicone encompasses many unique properties, such as high flexible backbone containing Si-O-Si, excellent thermal and oxidative stability, chemical resistance, low surface tension, and outstanding moisture resistance.…”