Toward a Universal Method To Pattern Metals on a Polymer

Abstract

Supporting Information. PS (M n :152K, M w /M n =1.05) was purchased from Pressure Chemical. The PS-b-PtBA (M n :16K-7.5K, M w /M n =1.08 and M n :6.4K-7K M w /M n =1.33) block copolymers were purchased from Polymer Source Inc. The photoacid generator (PAG), (tertbutoxycarbonylmethoxyphenyl)diphenylsulfonium triflate, was purchased from Aldrich.Nickel sulfate (98%, crystalline; source of Nickel II ions) was purchased from Alfa Aesar. Sodium citrate (complexant) was purchased from Fisher. Lactic acid (complexant and buffer) was purchased from Fluka. Dimethylamine-borane complex (97%; reductant) was purchased from Sigma-Aldrich. Ammonium hydroxide (5.08N solution in water; pH adjustor) was purchased from Sigma-Aldrich. Tetraammine palladium(II) chloride monohydrate (99.99+%; positive Pd catalyst) was purchased from Aldrich. Toluene (extra dry) was purchased from Acros Organics. Ethanol (ACS/USP grade) was purchased from Pharmco-AAPER. Deionized water (>18.2 MΩ cm, Millipore, Milli-Q) was used in aqueous solutions and rinsing procedures. Acetone (HPLC-UV grade-Reagent grade), purchased from Pharmco-AAPER, was used in rinsing procedures. All chemicals were used without further purification.

Selective Immobilization of Silver Nanoparticles onto Poly(acrylic acid)-Patterned Poly(tetrafluoroethylene) Surface Prepared by Using Radiation-Induced Graft Polymerization

“…[7][8][9] Various approaches including photolithography, surfacetemplate deposition, ink-jet printing, laser or e-beam writing, and soft lithography have been reported to pattern metal nanoparticles on a polymer substrate. [7][8][9][10][11][12][13][14][15][16] However, immobilization of metal nanoparticles on a polymer surface by using ion beam-induced graft polymerization has been rarely studied so far.…”

A Photocurable Pd Nanoparticle/Silica Nanoparticle/Acrylic Polymer Hybrid Layer for Direct Electroless Copper Deposition on a Polymer Substrate

“…While surface preparation, such as etching to increase the surface roughness, is necessary to provide good adhesion, it can affect the physical properties of the deposited metal film and damage the polymer substrate. Recently, to fabricate a micro pattern such as electric circuits, a simple and cost-effective approach containing direct metallization of photolithographic and printed patterns has attracted much attention [1,2,[12][13][14][15]. Copper is the most important metal in this process, because of its high conductivity and low electromigratory property.…”

Direct Electroless Copper Deposition on A Photolithographic Pattern of Palladium-Nanoparticle/Acrylic-Polymer Hybrid

“…Recently, an alternative approach to the fabrication of the metallic pattern using a combination of photolithography and electroless plating has been reported. [1][2][3][4] Copper is the most important metal for this because of its high conductivity and low electromigratory property. Therefore, we have proposed fabricating the copper micropattern by electroless plating on the pattern formed by photolithography as shown in Fig.…”