Towards a methodology for analysis of interconnect structures for 3D-integration of micro systems

Abstract

Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be provided to designers. Due to the variety of structures and effects of different physical domains, efficient modeling approaches and simulation algorithms have to be combined. The article describes a modular approach which covers detailed analysis with PDE solvers and model generation for system level simulation

Design rule check and layout versus schematic for 3D integration and advanced packaging

“…used for analysis of specific physical effects in 3D systems. Since these tools are usually not integrated into the design flow special methods are needed to integrate models and simulation results into the design process [3].…”

Integration of multi physics modeling of 3D stacks into modern 3D data structures

“…Hence, the hierarchical modeli roach, an appropriate methodology for multi level and multi physics analysis, proposed in [4], is used for a multitude of simulation tasks ( Figure 5). One essential element of this approach is to generat ingle or local structu d, one important step in the modeling flow is a toolindependent structural representation.…”

“…Therefore, interfaces between multi physics simulation and 3D data structures are urgently needed and are the main topic of this paper. Aiming at a fast evaluation of the cost function, a hierarchical modeling approach [4] can subsequently be combined with advanced methods for model abstraction and derivation of design guidelines.…”

Through silicon vias: from a physical point of view to a compact models initiation

“…The tool must be used to analyze the practice layout, to enter the electrical performance of the circuit and to calculate the impedance substrate matrix to analyze the substrate coupling. On this subject, some research programs have been published in recent years under electrical (Eo and Eisenstaedt, 1993;Savidis and Friedman, 2009), thermal (Lee, 2011;Schneider et al, 2008) or stress (Huang and Tan, 2011;Kong et al, 2011;Kwon et al, 2011;Ryu et al, 2012) analysis. The substrate extraction by BEM analysis has been proposed (Maffucci et al, 2004;de Magistris and de Tommasi, 2007;Weisshaar et al, 2002), but it is applied only to analyze coupling between contacts lying on the top surface of the substrate, not for 3D TSV structures.…”