2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) 2015
DOI: 10.1109/prime.2015.7251398
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Towards bendable CMOS magnetic sensors

Abstract: Abstract-This paper analyses the bending-induced stress effects on ultra-thin cross-shaped magnetic sensors operating in voltage-or current-modes. Both the magnetic sensor's sensitivity and the offset drift have been analysed. The optimum geometry and thickness of the Hall sensor are the important parameters to be analysed to compensate any mechanical stress related effect on the performance of sensors. Numerical simulations are carried out using the finite element method (FEM) with COMSOL Multiphysics softwar… Show more

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Cited by 21 publications
(20 citation statements)
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“…They are severely unstable to design analogue circuit and sensor blocks such as comparators, amplifiers and ADCs. [107] This is mainly due to low charge carrier mobility of organic semiconductors, which results in devices that are much slower than their inorganic counterparts. To overcome these challenges, new forms of high mobility material such as single crystal Si nanowires and ultra-thin chips have been investigated.…”
Section: Ultra-thin Silicon Chipsmentioning
confidence: 99%
“…They are severely unstable to design analogue circuit and sensor blocks such as comparators, amplifiers and ADCs. [107] This is mainly due to low charge carrier mobility of organic semiconductors, which results in devices that are much slower than their inorganic counterparts. To overcome these challenges, new forms of high mobility material such as single crystal Si nanowires and ultra-thin chips have been investigated.…”
Section: Ultra-thin Silicon Chipsmentioning
confidence: 99%
“…The integration of magnetic elements into electronic devices, often referred to as Magnetoelectronics [1][2][3][4], is an interesting development that has caught the attention of many working in the field of flexible electronics [5][6][7][8][9]. Magnetic sensors including Hall effect sensor, giant magnetoresistance (GMR) sensor, anisotropic magnetoresistance sensor (AMR) sensor, tunnel magnetoresistance (TMR) sensor etc., has been studied intensively during the past few years.…”
Section: Introductionmentioning
confidence: 99%
“…For example, in tactile skin, or e-skin, the electronics are required to conform to 3D surfaces, and this means electronics should bend [13,14]. The bending of electronics in this case (and in many other applications) induces stress on the devices, which results in deviation or alteration of the performance from the designed values [15,16]. A few attempts made to include stress-induced effects in device models are mainly related to strained silicon devices [17][18][19].…”
Section: Introductionmentioning
confidence: 99%