2017
DOI: 10.1002/pssa.201700467
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Towards High‐Mobility Heteroepitaxial β‐Ga2O3 on Sapphire − Dependence on The Substrate Off‐Axis Angle

Abstract: This paper presents the heteroepitaxial growth of β‐Ga2O3 thin films on off‐axis (0001) c‐sapphire substrates by low pressure chemical vapor deposition (LPCVD). (−201) oriented β‐Ga2O3 thin films are grown using high purity metallic gallium (Ga) and oxygen (O2) as the precursors. N‐type conductivity in silicon doped β‐Ga2O3 thin films is demonstrated. It is found that the film crystalline quality, surface morphology, and electrical conductivity are remarkably sensitive to the off‐axis angles. X‐ray phi‐scan me… Show more

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Cited by 100 publications
(72 citation statements)
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“…[30][31][32] The Si doped samples include a bulk CZ sample from Northrop Grumman Synoptics (Sample 3), a bulk EFG sample from Tamura Corporation (Sample 4), and two epitaxial films grown by LPCVD on c-sapphire substrates with 3.5° (Sample 5) and 6° (Sample 6) offcuts. 57 Glow discharge mass spectrometry (GDMS) and secondary ion mass spectrometry (SIMS) analysis of EFG Ga2O3 samples similar to Sample 4 and SIMS analysis of a CZ grown sample similar to Sample 3 confirm that Si is the dominant unintentional donor in the bulk melt-grown Ga2O3 used in this study. Our result is consistent with a previous study which determined that the unintentional Si doping comes from the Ga2O3 powder used as the source material for bulk melt-growth.…”
Section: While Breakdown Voltages Forsupporting
confidence: 56%
“…[30][31][32] The Si doped samples include a bulk CZ sample from Northrop Grumman Synoptics (Sample 3), a bulk EFG sample from Tamura Corporation (Sample 4), and two epitaxial films grown by LPCVD on c-sapphire substrates with 3.5° (Sample 5) and 6° (Sample 6) offcuts. 57 Glow discharge mass spectrometry (GDMS) and secondary ion mass spectrometry (SIMS) analysis of EFG Ga2O3 samples similar to Sample 4 and SIMS analysis of a CZ grown sample similar to Sample 3 confirm that Si is the dominant unintentional donor in the bulk melt-grown Ga2O3 used in this study. Our result is consistent with a previous study which determined that the unintentional Si doping comes from the Ga2O3 powder used as the source material for bulk melt-growth.…”
Section: While Breakdown Voltages Forsupporting
confidence: 56%
“…With the growth temperature increase, the (true2¯01) diffraction peak slightly shifts by small angles (about 0.03°), which may be subject to the release of stress within the films. The grain size (D) of β‐Ga 2 O 3 films can be extracted from the full width at half maximum (FWHM) of the (true4¯02) peaks according to the Scherrer's formula [ 26 ] D=0.9λBcosθwhere λ is the X‐ray wavelength, B is the FWHM of XRD peaks, and θ is the diffraction angle. With increasing the growth temperature, the grain size of β‐Ga 2 O 3 films increases from 33.9 nm (500 °C) to 51.3 nm (700 °C), as shown in Figure 1c.…”
Section: Resultsmentioning
confidence: 99%
“…The calculated width is less then the layer thickness of the β ‐Ga 2 O 3 , meaning that there are still free charge carriers. The activation energy of about 26 meV may be attributed to the silicon doping, since it is known that silicon forms a shallow defect in Ga 2 O 3 …”
Section: Resultsmentioning
confidence: 99%