13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems 2012
DOI: 10.1109/itherm.2012.6231583
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Transient analysis based thermal characterization of die-die interfaces in 3D-ICs

Abstract: In this paper, we present a novel methodology using a thermal test chip to characterize the bulk thermal conductivity and the thermal contact resistance of underfill materials in diedie interfaces of 3D stacks for application-realistic test conditions. Since a silicon chip is used, the thermal properties can be extracted for the same material interfaces (finishing of the Si surface) and the same processing conditions (bonding and temperature profile during curing of the underfill material) as in the intended a… Show more

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Cited by 14 publications
(2 citation statements)
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“…The boundary condition applied in the FEM to mimic these two sets of measurement are: a heat flux that represents the power dissipation in the heater stripes and a constant temperature at the thermochuck. The detailed procedure of the FEM calibration is explained in [22].…”
Section: Thermal Modelling Of the On-chip Heater Structurementioning
confidence: 99%
“…The boundary condition applied in the FEM to mimic these two sets of measurement are: a heat flux that represents the power dissipation in the heater stripes and a constant temperature at the thermochuck. The detailed procedure of the FEM calibration is explained in [22].…”
Section: Thermal Modelling Of the On-chip Heater Structurementioning
confidence: 99%
“…12. The reference underfill thermal conductivity is kUF=0.18 W/m-K, 21 a standard value for an unfilled epoxy underfill. A simulation with kUF=0 W/m-K results in a decrease of the effective thermal conductivity from 9.38 to 9.22 W/m-K.…”
Section: Mitigation Strategiesmentioning
confidence: 99%