Transient cooling of power electronic devices using thermoelectric coolers coupled with phase change materials

Caroff, T.; Mitova, Radoslava; Wunderle, Bernhard; Simon, Julia

doi:10.1109/therminic.2013.6675252

Cited by 11 publications

(5 citation statements)

References 5 publications

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“…Instead, lateral heat flux must be enabled for the TEC. TEC has also been investigated in combination with PCMs [142]. In this work, the junction temperature could be kept at 130 • C for one minute of 150% OC.…”

Section: Peltier Elementsmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technologies for the over-current performance of SiC power modules in power electronics converters. It presents the limitations produced at the power module level by packaging materials which include semiconductor chips, substrates, metallization, bonding techniques, die attach, and encapsulation materials. Specifically, technologies for over-current related temperatures in excess of 200 • C are discussed. The paper also discusses potential technologies which have been proven or may be potential candidates for improving the safe operating area. The discussed technologies are use of phase change materials below the semiconductor chip, Peltier elements, new layouts of the power modules, control and modulation techniques for converters. Special attention has been given to an overview of various potential phase change materials which can be considered for high-temperature operations.

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Section: Peltier Elementsmentioning

confidence: 99%

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Bhadoria

Dijkhuizen

Raj

et al. 2023

IEEE Trans. Power Electron.

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“… Schematic of thermoelectric cooling mechanism (a) brief description of the Peltier effect and (b) implementation on an avalanche transistorised pulse generator PCB board [82]. …”

Section: Applicability Analysis Of Different Heat Management Techniqu...mentioning

confidence: 99%

Heat management technology for solid‐state high voltage and high repetitive pulse generators: Towards better effects and reliability

et al. 2023

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Solid‐state high voltage high repetitive pulse generators have a broad prospect in various applications. The high power and high‐frequency operation of the pulse generator suffer from the massive heat dissipation problem, which limits the improvement of the output parameters and even affects the lifetime. This article focuses on heat management technology for high voltage high repetitive pulse generators. Firstly, the typical circuit topology of the high repetitive pulse generators was summarised. From the perspective of different application requirements, the demands of the heat management design were concluded. Moreover, the heat generation characteristics and difficulties of solid‐state high voltage high repetitive pulse generators were analysed. Then, the different state‐of‐art cooling techniques were reviewed, and their applicability and limitations for the high voltage high repetitive generators were discussed. Finally, a flow chart for heat management design was given.

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“…Putting (2) into (1) leads to the following expression (3), whose solution is the TEC current, which is needed to perform the desired cooling. �al2 �al (3) Referred to the system's coefficient of performance an optimal number of TE couples (or TEC modules, when using the material parameters of an effective TEC model) exists, minimizing the TEC's heat loss. To reduce the needed LHSM buffer volume, this should be taken into account, if possible.…”

Section: One-dimensional Modeling Of a Tee Assisted Thermal Buffermentioning

confidence: 99%

“…The effective one-TE-block model data has been derived from comparing simulations (optimization routines) with experiments and data sheet values (see section 3).…”

Section: (4)mentioning

confidence: 99%

Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing

Springborn

Wunderle

May

et al. 2014

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and

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In this paper, a new and dedicated phase change cooling concept is discussed, following the goal to buffer periodic overload operations of electric power modules and thus keeping junction temperatures constant. A top-mounted latent heat storage material (LHSM) buffer is applied, to soak the overload heat in conjunction with thermo-electric coolers (TECs), which control the temperature and phase change process. The cooling system is going to be realized within an IGBT converter module, undergoing repeated overload situations. The concept features double-sided cooling and assembling as well as new materials and joining technologies such as transient liquid phase bonding/soldering and silver sintering. One-dimensional equivalent circuit estimations and transient electro-thermal FE simulations were used to calculate the cooling performance, extract optimization guidelines and discuss potential difficulties of the concept. Furthermore, the simulations are successively refine d and brought into agreement with various test stands and characterization methods of reduced complexity

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Transient cooling of power electronic devices using thermoelectric coolers coupled with phase change materials

Cited by 11 publications

References 5 publications

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

Heat management technology for solid‐state high voltage and high repetitive pulse generators: Towards better effects and reliability

Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing

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