Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

Maity, Joydeep; Pal, Tapan Kumar; Maiti, Rishi

doi:10.1007/s10853-010-4402-y

Cited by 17 publications

(8 citation statements)

References 33 publications

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“…The interaction of particles with solidification front (causing particle push or particle engulfment) is a complicated phenomenon which depends on several factors. [25][26][27][28][29] According to the thermal conductivity model, 30 a particle with higher thermal conductivity has more probability to be engulfed than a particle with poor thermal conductivity. Furthermore, according to a relatively recent concept, for a velocity of solid/liquid interface above a critical velocity V C particle is engulfed.…”

Section: Resultsmentioning

confidence: 99%

Microstructural characterisation of novel 6351 Al–Al₄SiC₄in-situ composite

Mondal¹,

Biswas²,

Maity³

2013

Materials Science and Technology

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6351 Al–Al4SiC4 composite has been developed through stir casting route by incorporation of fine TiC powder in 6351 Al melt. Simultaneous effects of the generation of in-situ particles (Al4SiC4 and Al3Ti) and grain refinement were observed. The in-situ generated Al4SiC4 particles were found to act as nucleation sites for primary α (causing grain refinement) along with engulfment effect promoting uniform particle distribution. As the volume fraction of Al4SiC4 particles increased, the dendritic solidification was suppressed (more equiaxed grains appeared) and overall grain size of the matrix decreased. Besides, the precipitation of Al3Ti occurred at the dislocation enriched region. Accordingly, hardness of the composite was improved with increasing content of Al4SiC4 particles.

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Section: Resultsmentioning

confidence: 99%

Microstructural characterisation of novel 6351 Al–Al₄SiC₄in-situ composite

Mondal¹,

Biswas²,

Maity³

2013

Materials Science and Technology

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“…Shear strength was calculated by dividing the maximum force to the area of the bonding zone. By increasing the bonding time and continuous diffusion, the bonding zone became more homogenous and furthermore, the number of microporosities, preferable spot for crack initiation, decreased [24]. Therefore, by increasing the bonding time, the shear strength increased to a maximum of 60 MPa, which is 75% of the as-received composite.…”

Section: Shear Strength Of Samplesmentioning

confidence: 99%

On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite

Ghayoor

Hadian

2019

J. Compos. Sci.

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Transient liquid phase diffusion bonding of an aluminum metal matrix composite with 15 wt.% Mg2Si reinforcement particles using Cu powder interlayer at 560 °C for different bonding times has been studied. Three different zones were identified at the bonding line: athermally solidified zone, isothermally solidified zone and base metal. By increasing the bonding time, due to the diffusion of copper to the substrate, the width of the athermally solidified zone decreased, became more homogenous and the amount of intermetallic phase (CuAl2) decreased. Therefore, the shear strength increased to a maximum of 60 MPa for the samples with a holding time of 5 h at the bonding temperature.

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“…This means that Cu or Cu base interlayers are not good candidates for selection as an appropriate interlayer for TLP bonding of aluminium alloys. [6][7][8][9][10][11] Gallium forms a low temperature eutectic liquid phase with aluminium at y27uC, i.e. about room temperature (Fig.…”

Section: Tlp Bonding: Nature Of Processmentioning

confidence: 99%

“…This means that Cu or Cu base interlayers are not good candidates for selection as an appropriate interlayer for TLP bonding of aluminium alloys 6 –. 11…”

Section: Tlp Bonding: Nature Of Processmentioning

confidence: 99%

Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy

Ghaznavi

Ekrami

Kokabi

2011

Science and Technology of Welding and Joining

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Transient liquid phase (TLP) bonding of Al2024-T6 alloy, using gallium (Ga) interlayer, has been investigated. Bonding process was carried out at 470uC for 6 min, and homogenising temperature and time were 495uC and 2 h respectively. Conventional TLP bonding using Ga interlayer was not an appropriate method for joining of Al2024. In this method, the boundary between two Al2024 specimens was not fully eliminated during bonding because of solidification with planar front. In addition, bonding zone was depleted of copper, and as a result, tensile and shear strength of joint decreased to 200 and 110 MPa respectively. TLP bonding under temperature gradient offered very good results in bonding of Al2024. In this method, solidification mechanism change from planar to dendritic, and tensile and shear strength of joint increased to about 460 and 220 MPa respectively. Microstructure of bonding zone changed basically by changing solidification mechanism.

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Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

Cited by 17 publications

References 33 publications

Microstructural characterisation of novel 6351 Al–Al₄SiC₄in-situ composite

Microstructural characterisation of novel 6351 Al–Al₄SiC₄in-situ composite

On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite

Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy

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Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

Cited by 17 publications

References 33 publications

Microstructural characterisation of novel 6351 Al–Al4SiC4in-situ composite

Microstructural characterisation of novel 6351 Al–Al4SiC4in-situ composite

On the Role of Bonding Time on Microstructure and Mechanical Properties of TLP Bonded Al/Mg2Si Composite

Effect of solidification mechanism on microstructure and mechanical properties of joint in TLP bonded Al2024‐T6 alloy

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Microstructural characterisation of novel 6351 Al–Al₄SiC₄in-situ composite

Microstructural characterisation of novel 6351 Al–Al₄SiC₄in-situ composite