2020
DOI: 10.1109/ted.2020.3013242
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Trapping and Detrapping Mechanisms in β-Ga₂O₃ Vertical FinFETs Investigated by Electro-Optical Measurements

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Cited by 27 publications
(8 citation statements)
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“…In addition, the fabricated multi-fin β-Ga 2 O 3 FinFETs with W fin of 0.15 µm exhibit a record-high V br of 2.66 kV (at V gs = 0 V), a R on,sp of 25.2 mΩ cm 2 , and PFOM = 280 MW cm −2 , which is the highest among all Ga 2 O 3 transistors, as shown in figure 13(c). Recently, the trapping and detrapping mechanisms in vertical β-Ga 2 O 3 FinFETs have also been reported by the same group using electro-optical measurements [87]. They found that (a) a significant V th shift is observed when applied positive gate bias with V GS > 3 V, which cannot recover in…”
Section: Ga 2 O 3 Finfetsmentioning
confidence: 86%
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“…In addition, the fabricated multi-fin β-Ga 2 O 3 FinFETs with W fin of 0.15 µm exhibit a record-high V br of 2.66 kV (at V gs = 0 V), a R on,sp of 25.2 mΩ cm 2 , and PFOM = 280 MW cm −2 , which is the highest among all Ga 2 O 3 transistors, as shown in figure 13(c). Recently, the trapping and detrapping mechanisms in vertical β-Ga 2 O 3 FinFETs have also been reported by the same group using electro-optical measurements [87]. They found that (a) a significant V th shift is observed when applied positive gate bias with V GS > 3 V, which cannot recover in…”
Section: Ga 2 O 3 Finfetsmentioning
confidence: 86%
“…Apart from the above planar FinFETs [79,80], vertical β-Ga 2 O 3 FinFETs have also exhibited great device performance [83] (V br = 2.66 kV, I DS,max = ∼4.2 kA cm −2 , R on,sp = 25.2 mΩ cm 2 , PFOM = 280 MW cm −2 ) among β-Ga 2 O 3 power transistors, which is mainly demonstrated by Hu et al [82][83][84][85][86][87] from Cornell University. Vertical β-Ga 2 O 3 FinFETs have first reported in 2017 [86], and exhibited normally-off operation and decent device performance in publication of 2018, 2019 [82][83][84][85].…”
Section: Ga 2 O 3 Finfetsmentioning
confidence: 94%
“…For example, interesting dynamic phenomena such as output capacitance hysteresis 103 were reported in superjunction devices and the inter-fin design in FinFETs, which is not critical for R ON,SP and BV, was found to play a determining role in the switching speed and losses. 104 Reliability and robustness are also important aspects of these devices and work in this areas is increasing with reports looking at their avalanche and short circuit robustness, [105][106][107] gate reliability and stability, 108 as well as the cosmic ray robustness. 109 A recent example illustrates valuable robustness characteristics enabled by multidimensional device architectures where a GaN Fin-JFET was used as an avalanche GaN transistor.…”
Section: Discussionmentioning
confidence: 99%
“…Recently, one of the first detailed studies on vertical Ga 2 O 3 modules was performed by Fabris et al on 2.6 kV Ga 2 O 3 transistors as discussed earlier. [ 95 ] Their studies revealed that the devices show a significant positive shift in the threshold voltage with an applied gate bias >3 V. This was a non‐reversible shift in the threshold voltage except under UV illumination. The fabrication process for this device involved multiple steps for gate robustness such as wet etch to remove plasma damage caused by dry etch, post‐deposition annealing, etc.…”
Section: Vertical Ga2o3 Devices: Challengesmentioning
confidence: 99%