Tungsten Film Chemical Mechanical Polishing Using MnO 2 Slurry

et al. 2011

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MnO2 slurry can polish SiO2 film faster and planarize wide feature steps (2 ×2 mm2) to a lower height than conventional silica slurry. A comparison of Gibbs free energies indicates that the MnO2 abrasive directly reacts on the SiO2 film. In post-Chemical mechanical polishing (CMP), the MnO2 abrasive can be completely removed by dipping it in mixed solutions of inorganic acids and H2O2 followed by scrubbing and dipping in HF solution. A comparison of Gibbs free energies clarifies that the MnO2 abrasive on the wafer is easily dissolved in a mixed solution of an inorganic acid and H2O2.

Section: Resultsmentioning

confidence: 99%

Dielectric SiO₂ Planarization Using MnO₂ Slurry

et al. 2011

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“…As manganese oxide has been revealed to have some interesting characteristics, several corresponding studies have been performed. [22][23][24][25][26][27][28][29][30][31][32][33][34][35][36] Some of these studies reported that manganese oxide slurry polishes several materials such as tungsten, copper, SiO 2 , and low dielectric constant materials.…”

Section: Introductionmentioning

confidence: 99%

Mn₂O₃ Slurry Achieving Reduction of Slurry Waste

et al. 2012

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Fumed silica is widely used for SiO2 chemical mechanical polishing (CMP). In semiconductor processes, only fresh slurry is used, the used slurry being disposed of. We have demonstrated that Mn2O3 abrasive slurry polishes dielectric SiO2 film, giving 4 times the removal rate of conventional fumed silica slurry. The higher removal rate reduces the total amount of slurry used, consequently reducing the amount of used slurry waste. The removal rate of Mn2O3 slurry remains constant for solid concentrations between l and 10 wt %, and stays constant without pad conditioning. These characteristics are very useful for slurry reuse. Remanufacture of Mn2O3 slurry from used slurry has been demonstrated, and the removal rates of the remanufactured and fresh slurries are the same. Reuse and remanufacturing drastically reduce the amount of waste.

“…One of these is manganese oxide slurry. [18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33] We have performed previous studies of manganese oxide slurries and their application to CMP, [18][19][20][21][22] and established that MnO 2 abrasive polishes tungsten film without etching solution 19,20,24) and MnO 2 is also able to polish SiO 2 film faster than the conventional fumed silica slurry even without pad conditioning. [21][22][23][24] We further clarified that Mn 2 O 3 is capable of polishing SiO 2 film around 4 times faster than the conventional fumed silica slurry even without pad conditioning and is easy to remanufacture.…”

Section: Introductionmentioning

confidence: 99%

Mn₂O₃ Slurry Reuse by Circulation Achieving High Constant Removal Rate

et al. 2012

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Most commercial diffraction grating based spectroscopic devices employ entrance slit and optics based on the conventional Czerny-Turner (CT) configuration. A study was undertaken to design and develop a novel lab-scale electronic slitless spectrograph (ESS). The developed ESS has a tuneable spectral detectable range from approximately 450-1100 nm and a scanning speed of 0.7 s per spectrum. It works under reflectance mode with external illumination. System design employed a fibre optic waveguide as the probe, several focusing and collimating lenses, a plane reflection diffraction grating and a linear array charge-coupled device (CCD) detector. A method using a single-mode diode laser to calibrate the wavelength and pixel relationship was applied to obtain a least-square regression equation. An argon lamp was used to validate the calibrated wavelength equation and a maximum wavelength error of 1.95 nm was reported. A procedure to estimate the instrumental optical band-pass using laser spectra with a limited number of sampling points was examined. An optical band-pass expressed as full-width-at-half-maximum (FWHM) of 6.71 nm was estimated using the proposed method on the spectrum of the single-mode diode laser. The test results suggest that the developed ESS system has the potential to serve as a rugged and cost-effective spectroscopic device for routine inspection. The prototype consists of no moving parts and the complete assembly measures 30 cm × 25 cm × 15 cm, which can be greatly reduced upon further development.