2002
DOI: 10.1002/1521-4095(20020418)14:8<569::aid-adma569>3.0.co;2-o
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Two Component Particle Arrays on Patterned Polyelectrolyte Multilayer Templates

Abstract: The selective adsorption of two different types of particles to a patterned surface is shown for thiol‐modified gold. The far end of the alkanethiols is chemically varied and binds polymer particles with different properties—as illustrated in the Figure for charged polymer particles of different composition and size. Tuning of hydrophobicity and hydrogen bonding in this manner provides a versatile route to composite colloidal structures.

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Cited by 211 publications
(153 citation statements)
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“…Again, it is essential that H(x) is given by (20), so the integral in (23) must be proportional to a sum of exponentials, which is only possible if ρ 0 (x) is a constant: ρ 0 (x) = ρ 0 . Equation (31) transforms to…”
Section: Jammed Statesmentioning
confidence: 99%
See 1 more Smart Citation
“…Again, it is essential that H(x) is given by (20), so the integral in (23) must be proportional to a sum of exponentials, which is only possible if ρ 0 (x) is a constant: ρ 0 (x) = ρ 0 . Equation (31) transforms to…”
Section: Jammed Statesmentioning
confidence: 99%
“…This problem is motivated by recent experiments using self-assembly of nano-particles in the construction of nano-scale devices [12]- [20]. A colloidal solution of 50nm-size particles is deposited on a grooved substrate; evaporation and receding contact line drags the particles into the channels.…”
mentioning
confidence: 99%
“…그 작은 크기로 인해 특정 매트릭 스 내에 분산이 용이하여 전도성 접속 소재나 패키징, 전자 파 차폐 코팅, ESD(electrostatic discharge)코팅 등에 사용되 고 있다. [1][2][3][4] 반도체, LCD 및 모바일 기기산업의 급속한 성장 전망으로 인해 접속 소재의 수요 및 중요도는 증대될 것으로 예상되고 있다. 특히 휴대형 전자기기 시장이 날이 갈수록 커지고 있 어, 핵심 접속 재료인 이방성 도전필름(anisotropic conductive film)으로서 전도성 입자가 매트릭스에 분산되어있는 복합재 료(conductive particle-embedded composite material)가 주목 받고 있다.…”
Section: 서 론unclassified
“…The surface charge density was modulated by pH, ionic strength and effective surface charge of the polyelectrolyte. 82 However, only a moderate packing density was achieved due to the repulsive forces between the particles. In addition, a balance between the interactions involved during the nanoparticle assembly is needed to obtain an optimum adsorption strength and deposition selectivity.…”
Section: Patterning By Soft Lithographymentioning
confidence: 99%