Two-Phase Thermosiphon Cooling Using Integrated Heat Spreaders With Copper Microstructures

Abreu, Verónica; Harrison, Michael; Gess, Joshua; Moita, Ana S.

doi:10.1109/itherm.2018.8419644

Cited by 5 publications

(2 citation statements)

References 14 publications

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“…These possess improved heat transfer characteristics, and its manufacturing is simple. Their relevant operating parameters include the length of the heating/evaporation and condensation zones, the diameter of the thermosyphon channel, and the thermal properties of the refrigerant, among others [49]. A decrease in the diameter of the channel reduces the heat transfer rate, whilst the use of nanofluids provides a notorious increase in the nucleate-boiling critical heat flux of the two-phase thermosyphon [50,51].…”

Section: Thermosyphonsmentioning

confidence: 99%

Nanofluids for the Next Generation Thermal Management of Electronics: A Review

2021

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Nowadays, the thermal management of electronic components, devices and systems is one of the most important challenges of this technological field. The ever-increasing miniaturization also entails the pressing need for the dissipation of higher power energy under the form of heat per unit of surface area by the cooling systems. The current work briefly describes the use on those cooling systems of the novel heat transfer fluids named nanofluids. Although not intensively applied in our daily use of electronic devices and appliances, the nanofluids have merited an in-depth research and investigative focus, with several recently published papers on the subject. The development of this cooling approach should give a sustained foothold to go on to further studies and developments on continuous miniaturization, together with more energy-efficient cooling systems and devices. Indeed, the superior thermophysical properties of the nanofluids, which are highlighted in this review, make those innovative fluids very promising for the aforementioned purpose. Moreover, the present work intends to contribute to the knowledge of the nanofluids and its most prominent results from the typical nanoparticles/base fluid mixtures used and combined in technical and functional solutions, based on fluid-surface interfacial flows.

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Section: Thermosyphonsmentioning

confidence: 99%

Nanofluids for the Next Generation Thermal Management of Electronics: A Review

2021

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“…Pool boiling is a low-cost technique due to buoyancy of the bubbles in the absence of a pump. It can be used with direct immersion cooling for an increased power density and energy efficiency in cooling high power electronics [3][4][5]. Although water possesses a higher boiling heat transfer coefficient, it is not compatible with electronic devices for direct immersion cooling due to the problem of electrical short-circuit; on the other hand, dielectric fluids such as fluorochemical liquids are not electrically conductive and it has been proved to be highly suitable as a liquid medium for cooling [4].…”

Section: Introductionmentioning

confidence: 99%

A Predictive Model for Boiling Heat Transfer Coefficient of Dielectric Fluids on Metal Foams

Manetti

Moita

Cardoso

2020

Proceeding of 5th Thermal and Fluids Engineering Conference (TFEC)

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Pool boiling is a suitable technique for direct immersion cooling in electronic devices coupled with dielectric fluids. However, these fluids have relatively poor thermophysical properties in contrast to water, and extremely small contact angle that causes temperature overshooting at the boiling incipience. So, the use of surface enhancement techniques such as porous surfaces has been widely reported to enhance heat transfer performance and meet the cooling requirements. The porous thickness and pore size are the most important parameters of a porous surface, and their optimal values mainly depend on the fluid properties. This work aims to investigate the performance of metal foams of nickel and copper, with different pore diameter and thicknesses on pool boiling, using HFE-7100 as working fluid. A predictive model was proposed for the heat transfer coefficient (HTC) based on the Buckingham π theorem and experimental database. Additional data were taken from the literature for comparative purposes. The dimensionless numbers showed a greater contribution of the transient heat conduction and single-phase convection than the latent heat. In addition, as the pore diameter decreases the HTC increases. The thickness presents a variable exponent, which is a function of the heat flux, due to the balance of heat transfer area and vapor bubble resistance. The developed model accurately predicts 93% of the experimental data within an error band of ± 30% and absolute mean deviation of 13%; moreover, the developed model predicts 68% (within the ± 30% error band) of data from the literature for different working fluids and foams parameters.

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Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability

Liu

2022

J. Therm. Sci.

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Two-Phase Thermosiphon Cooling Using Integrated Heat Spreaders With Copper Microstructures

Cited by 5 publications

References 14 publications

Nanofluids for the Next Generation Thermal Management of Electronics: A Review

Nanofluids for the Next Generation Thermal Management of Electronics: A Review

A Predictive Model for Boiling Heat Transfer Coefficient of Dielectric Fluids on Metal Foams

Visualization of Boiling Heat Transfer on Copper Surface with Different Wettability

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