Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing

Advanced AI systems require more exotic packaging solutions to increase performance and manage power loads. Packaging designers not only need increased interconnect density through pitch scaling, but also seek to print this advantage over areas beyond the capability of standard lithography. These demands call for innovations in materials, processes, integrations, and tools for packaging.In a bid to find solutions for finer L/S pattern in redistribution layers, photo-imageable polyimides (PIDs) from different vendors were tested for performance properties (resolution, dose to size, sidewall quality) using direct write exposure methods, and then assessed for compatibility in a dual damascene (DD) integration for FOWLP packaging.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing

Cited by 4 publications

References 9 publications

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD Using Low-NA 300mm i-Line Stepper

Semi-Additive Fine Pitch RDL Litho-Process Development of 1000nm CD Using Low-NA 300mm i-Line Stepper

Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging

Performance comparison of photosensitive polyimides for high-resolution dual-damascene schemes for FOWLP packaging applications

Contact Info

Product

Resources

About