Ultra-Thin Chips on Foil for Flexible Electronics

Rempp, Horst; Burghartz, Joachim N.; Harendt, Christine; Pricopi, N.; Pritschow, Marcus; Reuter, Carsten; Richter, H.; Schindler, I.; Zimmermann, Martín

doi:10.1109/isscc.2008.4523193

Cited by 32 publications

(22 citation statements)

References 4 publications

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“…However, MEMS based tactile sensing devices cannot withstand large pressure/force due to their inherent fragile nature and therefore lacks flexibility and conformability needed for better integration with curved body parts. As flexible electronics are conceived as next generation technologies currently pursued by researchers around the world to support the strongly emerging market in this area [5]. Various approaches to thinning down and transfer to flexible substrate to obtain ultra-thin bendable tactile sensors have been investigated.…”

Section: Introductionmentioning

confidence: 99%

Towards bendable piezoelectric oxide semiconductor field effect transistor based touch sensor

Gupta

Heidari

Lorenzelli

et al. 2016

2016 IEEE International Symposium on Circuits and Systems (ISCAS)

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Abstract-This paper reports recent advances related to the piezoelectric oxide semiconductor field effect transistor (POS-FET) based touch sensing system research. We reported in past, the POSFETs with basic electronics realized on planar silicon substrates using CMOS technology. However, the planar POSFETs could not be used on 3D or curved surfaces such as the fingertip of a robot. To overcome this challenge we are now investigating the ultra-thin-chip approach for obtaining bendable POSFETs tactile sensing array. This paper presents this approach towards obtaining bendable POSFETs. Furthermore, for the first time the theoretical behavior of POSFETs devices are examined by combining the piezoelectric capacitor model proposed and the physics of underlying metal-oxide-semiconductor (MOS) FETs in the linear and saturation regions. The device characteristic equations are simulated using MATLAB and comparable matching is achieved with the experimental measurements. The model result gives a unique insight into geometrical and material properties of piezoelectric polymer on the electrical properties of transistor for flexible electronics applications. Using this model, the Spice simulation of POSFET device in a single-ended op-amp configuration, and the effect of chip thickness on deflection are presented.

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Section: Introductionmentioning

confidence: 99%

Towards bendable piezoelectric oxide semiconductor field effect transistor based touch sensor

Gupta

Heidari

Lorenzelli

et al. 2016

2016 IEEE International Symposium on Circuits and Systems (ISCAS)

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“…For long, the major drawback of using silicon technology for applications like electronic skin has been the lack of bendability. Recent technological advances such as ultra thin chips [6,7], and the Si-NW approach [8,9], however, hold a great promise in the direction of having silicon based mechanically flexible systems.…”

Section: Introductionmentioning

confidence: 99%

POSFET tactile sensing arrays using CMOS technology

Dahiya

Adami

Collini

et al. 2013

Sensors and Actuators A: Physical

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This work presents fabrication and evaluation of novel POSFET (Piezoelectric Oxide Semiconductor Field Effect Transistor) devices based tactile sensing chip. In the newer version presented here, the tactile sensing chip has been fabricated using CMOS (Complementary Metal Oxide Semiconductor) technology. The chip consists of 4 x 4 POSFET touch sensing devices (or taxels) and both, the individual taxels and the array are designed to match spatiotemporal performance of the human fingertips. To detect contact events, the taxels utilize the contact forces induced change in the polarization level of piezoelectric polymer (and hence change in the induced channel current of MOS). The POSFET device on the chip have linear response in the tested dynamic contact forces range of 0.01-3 N and the sensitivity (without amplification) is 102.4 mV/N.

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“…RFID) components. In this context, flexible or bendable chips are particularly interesting as they offer possibility of obtaining compact large scale integrated systems on flexible substrates, extremely low package heights, and flexible system-in-foil products [22], [23].…”

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confidence: 99%

Bendable Ultra-Thin Chips on Flexible Foils

Dahiya

Gennaro

2013

IEEE Sensors J.

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This paper presents ultra-thin silicon chips (flexchips) on flexible foils, realized through post-processing steps such as wafer thinning, dicing, and transferring the thinned chips to flexible polyimide foils. The cost effective chemical etching is adopted for wafer thinning and the transfer printing approach, to transfer quasi 1-D structures such as micro/nanoscale wires and ribbons, that is adapted for transferring large ultrathin flex-chips (widths 4.5-15 mm, lengths 8-36 mm, and thickness ≈ 15 µm). The post-processing capability is demonstrated with passive structures such as metal interconnects realized on the flex-chips before carrying out the chip thinning step. The resistance values of metal interconnects do not show any appreciable change because of bending of chips for the tested range viz., radius of curvature 9 mm and above. Further, the bending mechanics of silicon membranes on foil is investigated to evaluate the bending limits before a mechanical fracture/failure occurs. The distinct advantages of this paper are: attaining bendability through post-processing of chips, cost effective fabrication process, and easy transfer of chips to the flexible substrates without using conventional and sophisticated equipment such as pick and place set up.

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Ultra-Thin Chips on Foil for Flexible Electronics

Cited by 32 publications

References 4 publications

Towards bendable piezoelectric oxide semiconductor field effect transistor based touch sensor

Towards bendable piezoelectric oxide semiconductor field effect transistor based touch sensor

POSFET tactile sensing arrays using CMOS technology

Bendable Ultra-Thin Chips on Flexible Foils

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