Ultra-thin flattened heat pipe with a novel band-shape spiral woven mesh wick for cooling smartphones

Zhou, Wenjie; Li, Yong; Chen, Zhaoshu; Deng, Liqiang; Gan, Yong

doi:10.1016/j.ijheatmasstransfer.2019.118792

Cited by 61 publications

(30 citation statements)

References 36 publications

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“…Zhou et al and Deng et al [35,37,38] proposed a spiral woven mesh (SWM) wick structure to enhance the thermal performance of ultrathin flat heat pipe. The SWM was woven in a band shape to realize a very thin, tight structure.…”

Section: Mesh Wickmentioning

confidence: 99%

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Lim

Lee

2021

J Mech Sci Technol

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As the cooling capacity of the active cooling devices has reached their allowable heat flux limit, heat spreading technologies are becoming more remarkable in the thermal management of high-power electronics. Flat plate two-phase heat spreaders (FTHSs) are advantageous for the thermal management of electronic devices due to their simplicity, powerfree operation, and high reliability. This review is based on understanding the working mechanism and limitations of FTHSs. As the power density of electronic devices increases, researchers focus on performance improvement to overcome their malfunctioned working conditions. This review summarizes the major parameters of FTHS that affect heat transfer performance. Moreover, recent advances in FTHSs suggest that new design concepts can extend the maximum operating heat flux of thermal management devices. This review can establish a direction for studying higher-performance heat spreaders and identifying the latest trends.

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Section: Mesh Wickmentioning

confidence: 99%

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Lim

Lee

2021

J Mech Sci Technol

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“…As shown in Figure 2 [ 11 , 12 , 13 , 14 , 15 , 16 , 17 ], ultra-thin heat pipes have good application prospects because of their excellent heat dissipation performance and flexible structure in electronic mobile devices, high-power LEDs, and solar installations. In order to optimize the heat dissipation structure of mobile phones and to solve the problems of insufficient heat dissipation capacity, thick stacking, and large mass of traditional graphite or copper sheets, Zhou et al [ 11 ] designed an ultra-thin heat pipe, comparing it to copper sheets, and found that the ultra-thin heat pipe not only increases the maximum heat dissipation power by 28.57~42.86% but also reduces the weight of the heat dissipation structure by 64.51%. Zhou et al [ 12 ] applied a 1 mm ultra-thin heat pipe to a notebook computer and found that the maximum heat flux of the ultra-thin heat pipe on the notebook computer can reach 15 W under natural convection.…”

Section: Introductionmentioning

confidence: 99%

Research on the Manufacturing Process and Heat Transfer Performance of Ultra-Thin Heat Pipes: A Review

Duan

et al. 2022

Materials

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This paper reviews the manufacturing process of ultra-thin heat pipes and the latest process technologies in detail, focusing on the progress of the shape, structure, and heat transfer mechanism of the wick. The effects of the filling rate and tilt angle on the heat transfer performance of the ultra-thin heat pipe, as well as the material selection of ultra-thin heat pipes, is sorted out, and the surface modification technology is analyzed. Besides, the optimal design based on heat pipes is discussed. Spiral woven mesh wick and multi-size composite wick have significant advantages in the field of ultra-thin heat pipe heat transfer, and comprehensive surface modification technology has huge potential. Finally, an outlook on future scientific research in the field of ultra-thin heat pipes is proposed.

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“…In the last few decades, the fast rate of development of consumer electronics has resulted in a wide variety of miniaturized devices that run faster processors and are expected to operate for longer periods of time [ 1 ]. The increase in performance and usage time lead to a larger heat generation by those devices, which creates discomfort for the user, impairs the device performance, and shortens the life of electronic components, eventually leading to their failure [ 2 , 3 , 4 , 5 ]. Therefore, there is a need for enhanced thermal management materials in electronic packaging that are lightweight, easily processable, and cost-efficient [ 6 ].…”

Section: Introductionmentioning

confidence: 99%

Boron Nitride-Filled Linear Low-Density Polyethylene for Enhanced Thermal Transport: Continuous Extrusion of Micro-Textured Films

et al. 2021

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With shrinking size of electronic devices, increasing performance and accompanying heat dissipation, there is a need for efficient removal of this heat through packaging materials. Polymer materials are attractive packaging materials given their low density and electrical insulating properties, but they lack sufficient thermal conductivity that inhibits heat transfer rate. Hexagonal boron nitride (BN) possesses excellent thermal conductivity and is also electrically insulating, therefore BN-filled polymer composites were investigated in this study. Results showed successful continuous extrusion of BN-filled linear low-density polyethylene through micro-textured dies that is a scalable manufacturing process. Through-thickness thermal conductivity measurements established that 30 vol% BN content led to an over 500% increase in thermal conductivity over that of pure polymer. Textured film surface provided about a 50% increase in surface area when compared with non-textured films. This combination of increased surface area and enhanced thermal conductivity of BN-filled textured films indicates their potential application for improved convective thermal transport.

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Ultra-thin flattened heat pipe with a novel band-shape spiral woven mesh wick for cooling smartphones

Cited by 61 publications

References 36 publications

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Flat plate two-phase heat spreader on the thermal management of high-power electronics: a review

Research on the Manufacturing Process and Heat Transfer Performance of Ultra-Thin Heat Pipes: A Review

Boron Nitride-Filled Linear Low-Density Polyethylene for Enhanced Thermal Transport: Continuous Extrusion of Micro-Textured Films

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