1987
DOI: 10.1109/t-ed.1987.23181
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Ultra-thin Ta2O5dielectric film for high-speed bipolar memories

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Cited by 56 publications
(16 citation statements)
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“…However, SiO2 film has certain limitations. In addition, an extremely thin Ta2OJSiO2 film 7.5 nm thick has been applied to a high speed bipolar memory (13). Ta205 film seems to be an attractive candidate to replace SiO2 because of its dielectric constant of 22-28 (3-7) and its adequate dielectric breakdown strength (8)(9)(10).…”
mentioning
confidence: 99%
“…However, SiO2 film has certain limitations. In addition, an extremely thin Ta2OJSiO2 film 7.5 nm thick has been applied to a high speed bipolar memory (13). Ta205 film seems to be an attractive candidate to replace SiO2 because of its dielectric constant of 22-28 (3-7) and its adequate dielectric breakdown strength (8)(9)(10).…”
mentioning
confidence: 99%
“…Tavlama sıcaklığı 600 o C değerinin altında olduğu sürece ince filmlerin yapısında dikkate değer bir kristalleşmenin olmadığı daha önce Kimura tarafından bildirilmiştir [18]. Benzer şekilde Nishioka ve grubunun yapmış olduğu çalışmada da 20nm kalınlıklı Ta 2 O 5 ince filmler 1000 o C derecede 30 dakika tavlansa bile amorf yapısının bozulmadan kaldığı gözlenmiştir [20][21]. bölgelerinde farklı sıcaklık değerleri için gözlemlenen doğruların eğimlerinden rahatlıkla bulunur ve üssel ifade m Giuntini denklemi 3.4 ifadesiyle verilir [33].…”
Section: Deneysel Bulgular (Experimental Results)unclassified
“…After the Si wafers were cleaned in diluted hydrofluoric acid to remove the native oxide from the Si surface, amorphous Ta2Os films ranging from 7-40 nm in thickness were reactively sputtered onto the surface. Further details of the film deposition conditions are described in previous publications by the authors (7)(8)(9). The aluminum films used for the electrodes were sputtered onto the Ta2Os films and photolithographically patterned to form capacitors to measure the dielectric characteristics of the films.…”
Section: Methodsmentioning
confidence: 99%