Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

Shen, Wen-Wei; Chang, Hwan‐You; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei‐Chung; Chen, Kuan‐Neng

doi:10.1109/ectc.2015.7159818

Cited by 9 publications

(3 citation statements)

References 10 publications

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“…In the last decade, considerable efforts have been devoted to glass-polymer packages aiming to leverage the advantages of both material systems [76], [26]. This hybrid packaging approach utilities an ultra-thin glass core onto which organic build-up films are laminated and metal layers are patterned by means of a conventional SAP process (see Fig.…”

Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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“…After applying bonding film to the treated carrier and aligning it with the thin glass panel, the lamination process is done using a PCB laminator, shown in Fig. 3, at 90ºC with bonding force 24 kN for 5 minutes [7]. Aluminum (Al) was used as an RDL to replace copper (Cu) in order to match equipment capabilities in the FPD industries.…”

Section: Fig 2 Process Flow For Thin Glass Panel Laminationmentioning

confidence: 99%

A low-temperature temporary lamination and laser debonding technology to enable cost-effective fabrication of a through-glass-via (TGV) interposer on a panel substrate

Lee¹,

Su²,

Huang³

et al. 2015

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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This paper describes a handling process for a thin glass panel, 200 mm x 200 mm x 130 µm, through double-side redistribution layer (RDL) formation to enable cost-effective fabrication of through-glass-via (TGV) interposers.The integration scheme includes lamination of a lowtemperature bonding material utilizing a lamination process temperature of less than 100°C to bond a thin (130-µm) glass panel onto a carrier glass panel 700 µm thick. The carrier glass panel is treated with a 150-nm laser release layer prior to lamination of the bonding film and subsequently the thin glass panel. Next, the RDL is formed, and the front side of the thin glass panel undergoes aluminum physical vapor deposition (PVD) and polymeric dielectric material deposition. Then a second carrier glass panel, treated with the laser release material and laminated with bonding film, is bonded on the front side of the thin glass panel. An excimer laser with an x-y scanning stage is rastered across the first carrier to ablate the laser release layer for separation of first carrier. Following laser separation, a solvent cleaning step is performed to remove bonding material from the backside of the thin glass panel. The process of applying metal PVD, lithography, and dielectric material is repeated on the backside of the thin glass panel. Finally, the thin glass panel is mounted to tape, and the second carrier glass panel is released using laser ablation to reveal the front side of the thin glass for solvent cleaning and final inspection.The integration of the dry bonding film, thin glass panel lamination, and selective laser debonding technology in this study will pave the way for realization of panel-level packaging in the near future. IntroductionMany papers and publications have thoroughly studied the capabilities of silicon interposers to achieve 2.5-D stacking integration while minimizing the mismatch in coefficient of thermal expansion (CTE) with silicon integrated circuits (ICs) [1]. Mature infrastructure, including equipment, process, and supply chain, suggests that silicon interposers are ideal for high-pin-count IC applications. However, cost-related issues such as size limitations of silicon substrates and the need for electrical insulation around via sidewalls for silicon semiconductor materials are considered to be important issues for future high-volume manufacturing (HVM) [2].

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“…However, the current bonding methods for the glass are not suitable for the debonding of the glass substrates. The adhesive bonding is very popular way to bond [1]- [3], however, it cannot withstand the high temperature process. The hydrophilic bonding is also widely employed for the glass bonding, but the bond strength increases by heating process due to the decomposition of the OH groups in the bonding interface so that the debonding of the glass substrates after the high temperature [4]- [6].…”

Section: Introductionmentioning

confidence: 99%

Modified Surface Activated Bonding Using Si Intermediate Layer for Bonding and Debonding of Glass Substrates

2016

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This study reports the bonding and debonding technology based on the Surface Activated Bonding method for the handling of the thin glass substrates. The glass substrates are bonded by The Si intermediate layer oh under 10 nm thick. From the XPS analysis, the OH groups are formed in the bonding interface and the Si layer’s surface is oxidized by the reaction with the OH groups and water at high temperature. Additionally the Si intermediate layer remains on the deposited glass surface. AFM observation also shows the smooth debonded surfaces. From these results, the debonding at the bonding interface is confirmed.

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Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication

Cited by 9 publications

References 10 publications

RF Glass Technology Is Going Mainstream: Review and Future Applications

RF Glass Technology Is Going Mainstream: Review and Future Applications

A low-temperature temporary lamination and laser debonding technology to enable cost-effective fabrication of a through-glass-via (TGV) interposer on a panel substrate

Modified Surface Activated Bonding Using Si Intermediate Layer for Bonding and Debonding of Glass Substrates

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