Ultrathin thermally conductive yet electrically insulating exfoliated graphene fluoride film for high performance heat dissipation

Vu, Minh Canh; Thieu, Nhat Anh Thi; Lim, Jung‐Hyurk; Choi, Won Jae; Won, Jong Chan; Islam, M. A.; Kim, Sung‐Ryong

doi:10.1016/j.carbon.2019.10.079

Cited by 90 publications

(62 citation statements)

References 44 publications

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“…Recently, Kim et al produced an exfoliated graphene fluoride (EGF) film by directly exfoliating a graphite fluoride into the graphene fluoride solution using a ball milling method and then vacuum-assisted filtration [ 39 ]. The thinner EGF film could minimize the phonon scattering between the adjacent sheets and facilitate the phonon transfer in the horizontal structure of the EGF sheets, and as a result, the 10 μm EGF film showed a high thermal conductivity of 242 W·m −1 ·K −1 .…”

Section: Polymer Composites With Thermally Conductive Yet Electrically Insulating Carbon Fillersmentioning

confidence: 99%

A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

et al. 2021

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With the development of microelectronic devices having miniaturized and integrated electronic components, an efficient thermal management system with lightweight materials, which have outstanding thermal conductivity and processability, is becoming increasingly important. Recently, the use of polymer-based thermal management systems has attracted much interest due to the intrinsic excellent properties of the polymer, such as the high flexibility, low cost, electrical insulation, and excellent processability. However, most polymers possess low thermal conductivity, which limits the thermal management applications of them. To address the low thermal conduction of the polymer materials, many kinds of thermally conductive fillers have been studied, and the carbon-based polymer composite is regarded as one of the most promising materials for the thermal management of the electric and electronic devices. In addition, the next generation electronic devices require composite materials with various additional functions such as flexibility, low density, electrical insulation, and oriented heat conduction, as well as ultrahigh thermal conductivity. In this review, we introduce the latest papers on thermally conductive polymer composites based on carbon fillers with sophisticated structures to meet the above requirements. The topic of this review paper consists of the following four contents. First, we introduce the design of a continuous three-dimensional network structure of carbon fillers to reduce the thermal resistance between the filler–matrix interface and individual filler particles. Second, we discuss various methods of suppressing the electrical conductivity of carbon fillers in order to manufacture the polymer composites that meet both the electrical insulation and thermal conductivity. Third, we describe a strategy for the vertical alignment of carbon fillers to improve the through-plane thermal conductivity of the polymer composite. Finally, we briefly mention the durability of the thermal conductivity performance of the carbon-based composites. This review presents key technologies for a thermal management system of next-generation electronic devices.

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Section: Polymer Composites With Thermally Conductive Yet Electrically Insulating Carbon Fillersmentioning

confidence: 99%

A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

et al. 2021

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“…The miniaturization of electronic devices makes it produce a large number of heat during high frequency operation, which will reduce the degree of accuracy and curtail the service life of products [1,2] . The preparation of efficacious heat dissipation materials is a limiting factor for the further development of electronic products [3] .…”

Section: Introductionmentioning

confidence: 99%

Improving the Intrinsic Thermal Conductivity of Epoxy Resin by Synergistic Effect between Rigid Groups and Hydrogen Bonds

et al. 2021

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Although introducing liquid crystal phase into epoxy resin for liquid crystal epoxy fabrication is one of the most conventional methods for improving the intrinsic thermal conductivity of epoxy resin, the complex molecular structure design and sophisticated synthesis process seriously limit its rapid expansion and further industrial application. Herein, the rigid groups of 4’4‐dihydroxybiphenyl were introduced into the main chain of epoxy resin by ring‐opening polymerization (ROP) to change the molecular structure of epoxy resin. The introduction of biphenyl groups enhances the “orderliness” of molecular structure and forms hydrogen bonds between molecules, which facilitates the transmission of phonons within the molecule. The intrinsic thermal conductivity of modified epoxy resin (MEP) reaches 0.29 W m−1 K−1. After adding the expanded graphite (EG) into the MEP matrix, the thermal conductivity of MEP/EG reaches 2.59 W m−1 K−1, which is 1133 % higher than that of EP. In addition, the MEP also has certain advantages in harsh environment, the |Z|0.01 Hz of MEP coating is higher than 1.4 times the value of EP coating after immersing in 3.5 wt% NaCl solution for ten days, which identified the excellent anticorrosion of MEP. The MEP prepared by this method can find great applications as heat conduction materials in harsh environment.

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“…The heat dissipation becomes a main problem in many applications, such as integrated electronic devices, light emitting diodes (LEDs), and electronic packaging, [1][2][3] and an ideal TMM requires high-thermal conductivity, flexibility, low cost, and good processability. [4][5][6] In recent years, 3D printing as an additive manufacturing technology attracts wide attention because of its ability to fabricate complex parts using a computer-aided design without the need of conventional manufacturing technologies. 7 The fused-deposition modeling (FDM) approach has a potential to apply in real world owing to the speediness, low-cost, material variety, and high-dimensional accuracy.…”

Section: Introductionmentioning

confidence: 99%

“…The rapid development in electronic devices of small size and high speed processing requires high‐efficient thermal management materials (TMM), which facilitates the heat dissipation and relieves the thermal stress of component. The heat dissipation becomes a main problem in many applications, such as integrated electronic devices, light emitting diodes (LEDs), and electronic packaging, 1–3 and an ideal TMM requires high‐thermal conductivity, flexibility, low cost, and good processability 4–6 …”

Section: Introductionmentioning

confidence: 99%

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

Jeong

Kim

et al. 2020

J of Applied Polymer Sci

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Poly(lactic acid) (PLA) composite filaments with different copper (Cu) contents as high as 40 and 20 wt% of poly(methyl methacrylate) (PMMA) beads have been fabricated by twin-screw extruder for 3D printing. A fuseddeposition modeling (FDM) 3D printing technology has been used to print the PLA composites containing hybrid fillers of Cu particles and PMMA beads. The morphology, mechanical, and thermal properties of the printed PLA composites were investigated. The tensile strength was slightly decreased, but storage modulus and thermal conductivity of PLA composites were significantly improved by adding Cu particles in the presence of PMMA beads. The PLA composites with hybrid fillers of 40 wt% of Cu particles and 20 wt% of PMMA beads resulted in thermal conductivity of 0.49 W m −1 K −1 which was three times higher than that of the bare PLA resin. The facilitation of the segregated network of high-thermally conductive Cu particles with the PMMA beads in PLA matrix provided thermally conductive pathways and resulted in a remarkable enhancement in thermal conductivity.

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Ultrathin thermally conductive yet electrically insulating exfoliated graphene fluoride film for high performance heat dissipation

Cited by 90 publications

References 44 publications

A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

Improving the Intrinsic Thermal Conductivity of Epoxy Resin by Synergistic Effect between Rigid Groups and Hydrogen Bonds

3D printing of copper particles and poly(methyl methacrylate) beads containing poly(lactic acid) composites for enhancing thermomechanical properties

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