Uniform and Reliable Dip-Coated Conjugated Polymers for Organic Transistors as Obtained by Solvent Vapor Annealing

Kim, Gun Woo; Kwon, Eun Hye; Kim, Min; Park, Yeong Don

doi:10.1021/acs.jpcc.9b06996

Cited by 24 publications

(32 citation statements)

References 35 publications

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“…Some of the solution processed deposition techniques include spin coating [ 7 ], dip coating [ 8 ], shear coating [ 9 , 10 ], and inkjet printing [ 11 ]. Because of the simplicity of the setup and flexibility of testing different parameters, as well as the potential to achieve high-performance organic FETs, shear coating is the most ubiquitously used technique within the research community.…”

Section: Introductionmentioning

confidence: 99%

Charge Carrier Mobility Improvement in Diketopyrrolopyrrole Block-Copolymers by Shear Coating

et al. 2021

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Shear coating is a promising deposition method for upscaling device fabrication and enabling high throughput, and is furthermore suitable for translating to roll-to-roll processing. Although common polymer semiconductors (PSCs) are solution processible, they are still prone to mechanical failure upon stretching, limiting applications in e.g., electronic skin and health monitoring. Progress made towards mechanically compliant PSCs, e.g., the incorporation of soft segments into the polymer backbone, could not only allow such applications, but also benefit advanced fabrication methods, like roll-to-roll printing on flexible substrates, to produce the targeted devices. Tri-block copolymers (TBCs), consisting of an inner rigid semiconducting poly-diketo-pyrrolopyrrole-thienothiophene (PDPP-TT) block flanked by two soft elastomeric poly(dimethylsiloxane) (PDMS) chains, maintain good charge transport properties, while being mechanically soft and flexible. Potentially aiming at the fabrication of TBC-based wearable electronics by means of cost-efficient and scalable deposition methods (e.g., blade-coating), a tolerance of the electrical performance of the TBCs to the shear speed was investigated. Herein, we demonstrate that such TBCs can be deposited at high shear speeds (film formation up to a speed of 10 mm s−1). While such high speeds result in increased film thickness, no degradation of the electrical performance was observed, as was frequently reported for polymer−based OFETs. Instead, high shear speeds even led to a small improvement in the electrical performance: mobility increased from 0.06 cm2 V−1 s−1 at 0.5 mm s−1 to 0.16 cm2 V−1 s−1 at 7 mm s−1 for the TBC with 24 wt% PDMS, and for the TBC containing 37 wt% PDMS from 0.05 cm2 V−1 s−1 at 0.5 mm s−1 to 0.13 cm2 V−1 s−1 at 7 mm s−1. Interestingly, the improvement of mobility is not accompanied by any significant changes in morphology.

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Section: Introductionmentioning

confidence: 99%

Charge Carrier Mobility Improvement in Diketopyrrolopyrrole Block-Copolymers by Shear Coating

et al. 2021

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“…This technique has been used to coat substrates with polymers, 105,[127][128][129] biomolecules, [130][131][132][133][134] and, most relevantly, colloidal solutions. 104,135,136 Typically, dip-coating is performed by submerging a substrate in a reservoir containing a coating suspension and then withdrawing it vertically at a known velocity.…”

Section: Dip-coatingmentioning

confidence: 99%

Controlling disorder in self-assembled colloidal monolayers via evaporative processes

Roach

Hereu

Lalanne³

et al. 2022

Nanoscale

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“…Dip-coating has an intrinsic three-phase contact line (TPCL) that can easily modulate the assembly kinetics, , providing an optimal platform for the low-dimensional growth of OSCs. Until now, many ultrathin OSC films/microstructures have been realized with both small molecules and polymer semiconductors, ,,,,− as presented in Figure . However, the assembly mechanism was rarely discussed systematically before.…”

Section: Basic Assembly Kinetics Processmentioning

confidence: 99%

Microstructured Ultrathin Organic Semiconductor Film via Dip-Coating: Precise Assembly and Diverse Applications

Wang

Huang

et al. 2020

Acc. Mater. Res.

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Metrics & MoreArticle Recommendations CONSPECTUS: Organic semiconductors (OSCs) have led to considerable progress in various fields owing to their intrinsic flexibility, adjustable chemical structures, multifunctionalities, and low processing cost. The optoelectronic properties of OSCs greatly depend on their aggregation state in molecular assemblies. To obtain ideal and reliable optoelectronic performances, a highly controlled assembly method for modulating OSC packing structures is indispensable. In particular, ultrathin OSC microstructures consisting of one to several molecular layers, known as microstructured ultrathin organic semiconductor films (MUOSFs), are of great importance for both fundamental research and applications of OSCs. However, most reported film thicknesses or molecular layer numbers of ultrathin OSC films/ microstructures are "average values" rather than "real values" and are not molecularly precise. The lack of an effective and general assembly strategy seriously hinders the progress of MUOSFs. In this Account, we summarize our recent progress in exploring the assembly strategy, the underlying mechanism, and diverse applications of MUOSFs prepared via dipcoating under optimized conditions. Dip-coating, with an intrinsic three-phase contact line, has a great advantage to precisely assemble ultrathin OSC films/ microstructures. As an evaporation-controlled method, the assembly processes used in dip-coating are susceptible to multiple factors, such as pulling speed, molecular structures, and solution properties. Under the guidance of our proposed "Balance Principle" for adjusting these factors, uniform and continuous MUOSFs can be obtained over a large area. Under optimized conditions, the number of molecular layers of MUOSFs can be customized with monolayer precision, which is significant for investigating the charge transport mechanism of OSCs. At the same time, the ultrathin and partial coverage characteristics of MUOSFs are beneficial to fabricate flexible and transparent devices for wearable electronics. Notably, the morphologies and coverage of ultrathin microstripes can be well tuned by the pulling speed, which is highly desired for high-performance bio/chemical sensors, because the large specific surface area provides abundant reactive sites.The feasibility and generality of our assembly method demonstrate that dip-coated MUOSFs have excellent advantages for fundamental research and applications of OSC materials, based on which many promising future works around MUOSFs can be extended to more related fields by engineering molecular orientations, packing structures, film morphologies, coverage, etc. The work on the assembly and applications of MUOSFs might offer the potential to promote the progress of organic electronics.

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Uniform and Reliable Dip-Coated Conjugated Polymers for Organic Transistors as Obtained by Solvent Vapor Annealing

Cited by 24 publications

References 35 publications

Charge Carrier Mobility Improvement in Diketopyrrolopyrrole Block-Copolymers by Shear Coating

Charge Carrier Mobility Improvement in Diketopyrrolopyrrole Block-Copolymers by Shear Coating

Controlling disorder in self-assembled colloidal monolayers via evaporative processes

Microstructured Ultrathin Organic Semiconductor Film via Dip-Coating: Precise Assembly and Diverse Applications

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