2021
DOI: 10.1016/j.apsusc.2021.149274
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Uniform and robust TiN/HfO2/Pt memristor through interfacial Al-doping engineering

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Cited by 46 publications
(30 citation statements)
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“…The peak at 530.5 eV was associated with oxygen bonded to hafnium (i.e., HfO 2 ) and is known as the lattice peak. Meanwhile, the peak at 532.0 eV, known as the nonlattice peak, was observed in the region where the bonding between hafnium and oxygen was partially broken and served as a defect related to the presence of oxygen vacancies. , Figure a shows the O 1s spectra of the active layer with the Ti TE without PMA and with PMA at 400 °C for 1 h, respectively. As shown in Figure aa (top), the Ti TE-HM shows both lattice and nonlattice peaks in the O 1s spectra, and the proportion of the nonlattice peak in the peak sum was 23.41%.…”
Section: Resultsmentioning
confidence: 99%
“…The peak at 530.5 eV was associated with oxygen bonded to hafnium (i.e., HfO 2 ) and is known as the lattice peak. Meanwhile, the peak at 532.0 eV, known as the nonlattice peak, was observed in the region where the bonding between hafnium and oxygen was partially broken and served as a defect related to the presence of oxygen vacancies. , Figure a shows the O 1s spectra of the active layer with the Ti TE without PMA and with PMA at 400 °C for 1 h, respectively. As shown in Figure aa (top), the Ti TE-HM shows both lattice and nonlattice peaks in the O 1s spectra, and the proportion of the nonlattice peak in the peak sum was 23.41%.…”
Section: Resultsmentioning
confidence: 99%
“…Thus, the Zr x Al y O z interfacial layer could perform as a reservoir of defects below the host ZrO 2 and, possibly, be a source of ionic current. Application of a similar interface layer has recently been reported in studies of TiN/HfO 2 :Al/HfO 2 /Pt [37] and Pt/Al 2 O 3 /HfO 2 /HfAlO x /TiN [38] RRAM stacks. In the present study, the content of aluminum in the Zr x Al y O z buffer layer was expected to be lower than that of zirconium, because in the successive exposures of surface to ZrCl 4 and Al(CH 3 ) 3 without intermittent supply of oxygen precursor, the incorporation of zirconium into the film material was more likely than that of aluminum.…”
Section: Methodsmentioning
confidence: 84%
“…An electroforming process was preceded by applying −6 V with a 10 –5 A of compliance current ( I cc ) to prevent permanent breakdown. After electroforming, a typical bipolar resistive switching characteristic can be observed; the device was set from a high-resistance state (HRS) to a low-resistance state (LRS) at about −1.2 V, and reset from the LRS to the HRS at about +1.5 V. , Also, it showed an analog switching characteristic in a DC I – V sweep, as shown in Figure b. Here, the device was set-switched gradually from the HRS by increasing I cc from 0.05 mA (dark green) to 2 mA (light green) during a negative DC I – V cycle from 0 to −2 V. Afterward, the device was gradually reset from the LRS by a positive DC I – V cycle from 0 V to the incremental reset stop voltage ( V res,stop ) from 1.2 V (yellow) to 2.4 V (red).…”
Section: Resultsmentioning
confidence: 95%