Uniform groove-depths in (110) Si anisotropic etching by ultrasonic waves and application to accelerometer fabrication

Ohwada, K.; Negoro, Y.; Konaka, Y.; Oguchi, T.

doi:10.1016/0924-4247(96)80090-2

Cited by 25 publications

(14 citation statements)

References 5 publications

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“…The washer generates dynashock waves, whose frequency is switched between 28, 45, and 100 kHz. According to Ohwada et al (1995), this instrument allows a uniform etching rate independent of slit widths and pitches. 9 Hence we expected smoother (111) planes.…”

Section: Micro Roughnessmentioning

confidence: 99%

Recent development of micropore optics using MEMS technologies

et al. 2006

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Recent development of the extremely light-weight micro pore optics based on the semiconductor MEMS (Micro Electro Mechanical System) technologies is reported. Anisotropic chemical wet etching of silicon (110) wafers were utilized, in order to obtain a row of smooth (111) side walls vertical to the wafer face and to use them as X-ray mirrors. To obtain high performance mirrors with smooth surfaces and a high aspect ratio, several modifications were made to our previous manufacturing process shown in Ezoe et al. (2005). After these improvements, smooth surfaces with rms roughness of the order of angstroms and also a high aspect ratio of 20 were achieved. Furthermore, a single-stage optic was designed as a first step to multi-stage optics. A mounting device and a slit device for the sample optic were fabricated fully using the MEMS technologies and evaluated.

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Section: Micro Roughnessmentioning

confidence: 99%

Recent development of micropore optics using MEMS technologies

et al. 2006

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“…The double vertical micromirrors and the optical fiber V-grooves with smooth side surfaces are fabricated using anisotropic bulk etching in KOH solution under ultrasonic conditions at once, by which means the light beam calibration is obtained automatically. The ultrasonic agitation can provide a good control for uniformity, surface quality, and rate of etching [8,9]. Because of the unique anisotropic etching characteristics of (110)-oriented silicon wafer, the process.…”

Section: Process Flow Designmentioning

confidence: 99%

A Novel Miniature Optical Switch With Double Vertical Micromirrors Driven by Piezoelectric Cantilever

Fang

Liu

Zhang

et al. 2005

Integrated Ferroelectrics

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This paper presents a novel miniature 2 × 2 optical switch with double vertical micromirrors driven by single piezoelectric cantilever using PZT (Lead Zirconium Titanate) films. Double vertical micromirrors, piezoelectric cantilever and optical fiber V-grooves are integrated on a single silicon chip in compact and low-cost form. The optical switch switches light beams by moving perpendicularly double vertical micromirrors with smooth side surfaces simultaneously which are driven by single piezoelectric cantilever using PZT films. The fabrication process of the optical switch is described. Simulation and analysis have been carried out to evaluate mechanical performance of the optical switch. Due to low insertion loss, small switch size and low power dissipation, this novel optical switch should be promising for optical network applications.

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“…It has been applied to the comb-type narrow-gap electrodes for an accelerometer [1], the optical reflectance reduction of solar cell [2], the micro-grooved needle for a trace blood by imitating mosquito [3], the fuel channels of miniature fuel cell electrodes [4], and the fiber alignment in V-groove optic fiber connector [5]. The above-mentioned micro-groove fabrications depend on lithography, etching or laser techniques, but they require extensive capital investment and process time.…”

Section: Introductionmentioning

confidence: 99%