“…We also present preliminary results of the application of SAM layers as a patterned resist to plate thin lines of nickel, nickel here being meant to become an adhesion layer prior to copper plating. 12,12,13,13,14,14,15,15,15,15-nonafluoropentadecylphosphonic acid (fC15-PA), 12,12,13,13,14,14,15,15,16,16,17,17-tridecafluoroseptadecylphosphonic acid (fC17-PA), 12,12,13,13,14,14,15,15,16,16,17,17,18,18,19,19,19-Heptadecafluorononadecylphosphonic acid(fC19-PA), and 10,11-Bis (2,2,3,3,4,4,5,5,6,6,7,7,8,8,…”