Upstream electromigration study on multiple via structures in copper interconnect

Lin, Ming Chang; Jou, Nick; Liang, James W.; Juan, Alex; Su, K. C.

doi:10.1109/iitc.2009.5090347

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“…3D simulations on the void nucleation time using line-via structure have also been reported by many [7][8][9][10]. However, as the current density is no longer the sole driving force for EM, and the surrounding materials and their materials properties of an integrated circuit are the key factors in determining the heat dissipation and the degradation rate in the circuit [11], 2D or simple line-via structure modeling is no longer adequate.…”

Section: Introductionmentioning

confidence: 95%