Use of Non-conductive Film (NCF) with Nano-Sized Filler Particles for Solder Interconnect: Research and Development on NCF Material and Process Characterization

Nagamatsu, Tatsuo; Honjo, Keiji; Ebisawa, K.; Ishimatsu, Tomoyuki; Saito, Takayuki; Mori, Daichi; Motomura, Daisuke; Yagi, Hidekazu

doi:10.1109/ectc.2016.224

Cited by 5 publications

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Nanopackaging: Nanotechnologies and Electronics Packaging

Morris

2018

Nanopackaging

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