Using TSVs for thermal mitigation in 3D circuits: Wish and truth

Santos, Carla Eliete Iochims dos; Souare, Papa Momar; Crecy, F. de; Coudrain, P.; Colonna, Jean-Philippe; Vivet, Pascal; Borbély, András; Reis, Ricardo; Jamaa, Haykel Ben; Fiori, Vincent; Farcy, A.

doi:10.1109/3dic.2014.7152167

Cited by 10 publications

(1 citation statement)

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“…These results indicate that, in some cases, TSV arrays may provoke exacerbated hotspots and shows that enhancing the thermal coupling between adjacent dies, as already discussed in the previous section, is much more adequate for temperature reduction than using area costly TSVs. Numerical simulations and experimental data from a dedicated thermal test chip are presented in [11] for an extensive study of the effectiveness of TSV arrays for heat dissipation in 3D integrated circuits. IV.…”

Section: Through-silicon Viasmentioning

confidence: 99%

Thermal performance of 3D ICs: Analysis and alternatives

Santos

Vivet

Colonna

et al. 2014

2014 International 3D Systems Integration Conference (3DIC)

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3D ICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies. Based on this assumption, heat dissipation is frequently pointed as one of the remaining challenges in the promising 3D integration technology. This work brings an overview of the thermal impact of the 3D integration technology, providing means to investigate causes and alternative solution for the existing thermal issues in 3D ICs. A complete chip-package-board system is used to evaluate the thermal performance of a memory-on-logic 3D circuit. Thermal simulations and silicon measurements from two fabricated versions of a SoC instrumented with integrated heaters and thermal sensors are compared to reveal the temperature profile changes resulting from 3D integration. This work also provides a comprehensive discussion of the four main aspects differentiating heat dissipation in 3D ICs: chip footprint, die thickness, inter-die interface and TSVs. This study demonstrates, for instance, that non-thinned stacked dies may act as heat spreaders and help to alleviate hotspot issues while TSVs are in fact not effective for thermal mitigation. Lastly, this work proposes the use of graphitebased heat spreaders as an alternative to compensate the poor heat dissipation properties exhibited in 3D ICs. Simulation results show a temperature reduction of up to 45ºC and suggest this is a potential cost-effective method for thermal management. The discussion presented in this work aims to understand the thermal impact of technology parameters inherent in 3D integration and supports system architects and designers to take early design decisions and prevent thermal issues.I.

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Section: Through-silicon Viasmentioning

confidence: 99%