UV/Ozone Cleaning of Surfaces

Abstract

FORT MONMOUTH, NEW JERSEY 07703-5302 NOTICES DisclaimersThe citation of trade names and names of manufacturers in this report is not to be construed as official Government indorsement or approval of commercial products or services referenced herein. Destruction NoticeDestroy this report when it is no longer needed. "itThe UV/ozone method, which is reviewed in this repo-Tt, is anefective method of removing a vat jety of contaminants from surfaces. It is a simlple-to-use dry process which is inexpensive to set up and operate. It can rapidly produce clean surfaces, in air 3r in a I vacuum systemn, at ambient temperatures. Placing properly precleaned surfaces wilhin a few millimeters of an ozonIe-producing UV Source can produce clean surfaces in less than one mlinute.

Bonding of thermoplastic polymer microfluidics

“…This method is derived from a UV/ ozone exposure technique originally developed for the removal of organic contaminants from semiconductors as an alternative to oxygen plasma ashing (Bolon and Kunz 1972;Sowell et al 1974;Vig and LeBus 1976;Vig 1985). Using a low-pressure mercury lamp to expose a substrate in an air-filled chamber at atmospheric pressure, light output at a wavelength of 184.9 nm is absorbed by oxygen in the air, resulting in the generation of ozone.…”

Self-assembled structures of alkanethiols on gold-coated cantilever tips and substrates for atomic force microscopy: Molecular organisation and conditions for reproducible deposition

“…The successful deposition of alkanethiol SAMs requires the gold substrates to be freshly cleaned by, for example, annealing in a hydrogen-oxygen flame [6], or by exposure to UV/ozone [7][8][9][10][11], or by treatment with a cleaning solution [12][13][14][15][16][17]. For the deposition of a monolayer, the cleaned substrate is immersed in an ethanolic solution of the thiol, rinsed (ethanol), dried (nitrogen) and used immediately [5].…”

Adhesion at Poly(Butylacrylate)–Poly(Dimethylsiloxane) Interfaces

“…The adsorbed layer of pure resin was obtained by spin coating a solution of MQ resin in xylene, (5% by weight) on a silicon wafer previously cleaned by a UV-ozone treatment [8]. After drying, a layer of MQ resin with a thickness of 150 nm as measured by ellipsometry was obtained, with a typical surface roughness of 1 nm.…”