Amorphous and polycrystalline compounds of ͑Ga,As͒ and ͑Al,As͒ grown at very low temperatures by molecular-beam epitaxy are characterized. The ultimate microstructure and the amount of excess arsenic incorporated in the ͑Ga,As͒ or ͑Al,As͒ layers are found to depend on the arsenic overpressure during the low-temperature growth. With lower arsenic overpressure, a polycrystalline structure prevails and less excess arsenic is observed inside the layer. In contrast, a high incorporation of excess arsenic achieved by high-arsenic overpressures leads to the formation of amorphous films. Upon wet oxidation, the lateral oxidation rate of ͑Al,As͒ is found to depend on the crystallinity of the ͑Al,As͒ layer and the amount of excess arsenic. During the same process, recrystallization proceeds in the ͑Ga,As͒ layer.