Abstract-Vertical InAs nanowire transistors are fabricated on Si using a gate-last method, allowing for lithography-based control of the vertical gate length. The best devices combine good ON-and OFF-performance, exhibiting an ON-current of 0.14 mA/µm, and a sub-threshold swing of 90 mV/dec at 190 nm L G . The device with the highest transconductance shows a peak value of 1.6 mS/µm. From RF measurements, the border trap densities are calculated and compared between devices fabricated using the gate-last and gate-first approaches, demonstrating no significant difference in trap densities. The results thus confirm the usefulness of implementing digital etching in thinning down the channel dimensions.