Vertical optical communication through stacked silicon wafers using hybrid monolithic thin film InGaAsP emitters and detectors

Transfer of InP epilayers by wafer bonding

“…Indirect bonding technologies that are easier to use include adhesive bonding or eutectic bonding, where intermediate layers of polymers [20][21][22][23][24][25][26][27][28]36], spin-on-glasses [37] and metals [17][18][19]38]. These methods may ease bonding of dies to wafers, reducing the amount of III-V material to be used on a Si wafer.…”

A 100 Mbps, LED Through-Wafer Optoelectronic Link for Multicomputer Interconnection Networks

“…Thin-film emitters and detectors operating at a wavelength of 1.3 m (to which silicon is transparent) will be bonded to silicon drivers and amplifiers, respectively, to create this optical link. An epitaxial liftoff process employing a transfer diaphragm has been developed to perform the integration [4], and a bidirectional through-wafer link has been presented previously using InP/InGaAsP P-i-N detectors and InGaAsP p-n emitters integrated with standard silicon circuitry [3,11]. In this paper, we present an analysis of the tradeoffs inherent in such an integration.…”

“…The integration is simplified because only a single step is necessary to bond both the emitter and the detector to a circuit. This design, however, is not a limitation of the integration technology, as separately optimized detector and emitter structures integrated onto the same circuit have been demonstrated [3]. The tradeoff for ease of integration is in the performance of the detector.…”

A Scalable Optical Interconnection Network for Fine-Grain Parallel Architectures

“…Existing optical interconnect techniques such as index-guided and freespace networks are difficult to incorporate in threedimensional interconnection networks. This paper describes a three-dimensional optoelectrical network using hybrid integrated optoelectronic devices [2] and through-wafer transmissions [1]. The network is designed to provide 3.2 Gbits/sec off-chip bandwidth using vertical optical channels to eight neighboring chips.…”