Vertically coupled microring resonators using polymer wafer bonding

Absil, P.; Hryniewicz, J.V.; Little, Brent E.; Johnson, F.G.; Ritter, K. J.; Ho, P.‐T.

doi:10.1109/68.903217

Cited by 74 publications

(23 citation statements)

References 9 publications

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“…Transfer bonding is used for the fabrication and integration of the optical transducer arrays on standard CMOS wafers, i.e., uncooled infrared focal plane arrays ͑e.g., bolometer detectors, pyroelectric detectors͒, 13,71,73,147 optical transducer systems ͑e.g., spatial light modulators, tunable vertical coupled surface emitting lasers͒, 13,106,111,214 and imaging systems and laser systems. 37,38,46,103,136,137 Transfer bonding of films and devices is also used to process material films ͑e.g., singlecrystalline silicon, gallium arsenide, etc.͒ on the front-and backside 13,34,46,49,68,71,76 and to transfer high-frequency components to new, low-loss substrates. 15,39,40,42,47,130,131,135,154,209 Figure 15 shows an example for the process flow for fabrication of monocrystalline silicon micromirrors using membrane transfer bonding.…”

Section: B Film and Device Transfer For Integration Of Mems And Elecmentioning

confidence: 99%

Adhesive wafer bonding

Niklaus

Stemme

Lü

et al. 2006

Journal of Applied Physics

428

307

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Section: B Film and Device Transfer For Integration Of Mems And Elecmentioning

confidence: 99%

Adhesive wafer bonding

Niklaus

Stemme

Lü

et al. 2006

Journal of Applied Physics

428

307

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show abstract

“…The high index-contrasts of the waveguides means that even small changes in lithography can cause substantial changes in resonance wavelengths. For example, in [27], we fabricated rings with the same dimensions in two lithography steps, and found that there was a change of 3 nm in resonance wavelength. Another major problem is etching -III-Vs typically require dedicated etch chambers, and the etch quality is very sensitive to process history and chamber contaminants, which imposes significant equipment costs on fabs -ICP-RIEs configured with end-point detection systems typically cost anywhere from half-a-million to a million dollars, or more.…”

Section: Fabrication Of Iii-v Ringsmentioning

confidence: 98%

“…We refer the reader to [28,29,30,27,31,32,33,6,34,35] for more. Examples of linear performance are summarized in Table 2.…”

Section: Linear Optical Characteristicsmentioning

confidence: 99%

III-V Semiconductor Optical Micro-Ring Resonators

Grover¹

2004

AIP Conference Proceedings

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We describe the theory of optical ring resonators, and our work on GaAs-AlGaAs and GaInAsP-InP optical micro-ring resonators. These devices are promising building blocks for future all-optical signal processing and photonic logic circuits. Their versatility allows the fabrication of ultra-compact multiplexers/demultiplexers, optical channel dropping filters, lasers, amplifiers, and logic gates (to name a few), which will enable large-scale monolithic integration for optics.

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“…Dependence of threshold current density deviation, quality factor, and differential slope efficiency of vertically coupled microring laser on lateral misalignment. the taper configuration that had been experimentally evaluated for enhanced fiber coupling efficiency in [26], [27].…”

Section: Double Taper Configurationmentioning

confidence: 99%

Fabrication-tolerant active-passive integration scheme for vertically coupled microring resonator

Tee

Williams

Penty

et al. 2006

IEEE J. Select. Topics Quantum Electron.

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Abstract-The large-scale photonic integration of microring resonators in three dimensions made possible by recent developments in vertical coupling and wafer bonding technology is shown to be sensitive to lateral mask misalignment for the ring and bus waveguides introduced during the fabrication process. For a typical 20-µm radius, vertically coupled microring calculations reveal a linear relationship between deviation in the coupling coefficient and lateral misalignment. A coupling coefficient reduction of 50% is predicted for a lateral misalignment of 0.3 µm, which is typical for an alignment accuracy limited by the current state-of-theart mask alignment process. The use of a wide multimode bus waveguide is proposed to ameliorate this alignment sensitivity. The mode-expanded bus waveguide, together with its physically wider structure, reduces the dependence of modal overlap and coupling length on precise alignment, resulting in significantly relaxed fabrication tolerance. Deviation of coupling coefficient decreases by an order of magnitude for the new ring coupler geometry, where a sole reduction of 5% is obtained for the same amount of misalignment. The implications of the proposed structure are subsequently investigated for microring laser performance. The differential slope efficiency is shown to be at least five times less sensitive to lateral misalignment for the proposed structure within a small misalignment regime. This readily adaptable coupler geometry based on existing vertical coupling architectures is transferable to any fabrication scheme with multiple waveguide layers coupled vertically, and is of particular importance to microring resonators with small radii.

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Vertically coupled microring resonators using polymer wafer bonding

Cited by 74 publications

References 9 publications

Adhesive wafer bonding

Adhesive wafer bonding

III-V Semiconductor Optical Micro-Ring Resonators

Fabrication-tolerant active-passive integration scheme for vertically coupled microring resonator

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